White paper

How can thermally conductive liquid materials help for electronics packaging

Learn about the performance, manufacturing, and reliability issues related to thermally conductive liquids. Significant differences with respect to solid pad like materials and unfilled liquids will be explored.

Get access now

Already have an account?

There is a technical issue, the service is not available and your request is not sent. Please come back later.

Personal details Company details Communication preferences

Step 1 of 3

First name

Last name

Business email

This information will be saved to your account. Go to your account to make changes at any time.

Company name

Size of your organization

Specify the approximate number of employees in your organization within the US.

Market segment

Specify the market segment that best fits the nature of your business.

We, Henkel Corporation would like to personalize our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under read more), to provide you and the company you are representing, with the most relevant and interesting content.

In particular, we will analyze your use of (1) our newsletter and other e-mail advertisements, (2) our websites, as well as (3) your previous interactions with us, including inquiries and complaints you have issued and purchases you have made for your company, (4) your participation in online and offline events (either hosted by us or a third party), (5) your engagement with our online advertisements on our website as well as third party websites and apps, and (6) the publicly accessible information contained in your professional social media profiles, as well as anonymize any such information in order to enable further analysis of your interactions with us without being able to attribute any such information to you.

I agree to the analysis of my personal data as described above and I want to receive personalized digital content about Henkel Adhesive Technologies, including product offers and other communications:

Select all

Via e-mail

I want to receive the personalized Newsletter and other E-Mail advertisements from you, based on the analysis of my personal data as described above providing me with personalized and up to date information on all products and proposals in the field of Adhesives relevant to me and/or my company.

Via Facebook and LinkedIn

I want advertisements for your products and events regarding adhesives shown to me on Facebook and LinkedIn to be personalized based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to Meta Platforms Ireland Ltd., 4 Grand Canal Square, Grand Canal Harbour, Dublin 2 Ireland and LinkedIn Corporation, 1000 W. Maude Avenue, Sunnyvale, CA 94085, USA for this purpose.

Via (other) third party websites and apps

I want my experience of product offers, digital content and services of Henkel Corporation and online communication regarding its products and events, also on third party websites and apps, to be personalised based on the analysis of my personal data as described above. My email address and/or my user ID will be transferred to marketing and advertising partners for this purpose.

You may withdraw your consent at any time with effect for the future, for example by managing your communication preferences or deleting your account in the user profile, or by clicking “unsubscribe” or as otherwise described in any of our websites, emails, push notifications or text messaging, as may be applicable to you.

By clicking Get access now, I agree to be bound by the Henkel Terms of Use. I also acknowledge and consent to the practices described in Henkel’s Privacy Policy and CA Privacy rights.

Thermal Management Material Product Guide Whitepaper

The significant advantages of using thermally conductive liquids can best be realized when understanding some fundamental characteristics of these materials. We will present the performance, manufacturing, and reliability issues related to thermally conductive liquids. Significant differences with respect to solid pad like materials and unfilled liquids will be explored.In this paper we will start with a general description of thermal interfaces. The two subsequent sections will then address the basic structure and properties of thermally conductive materials through a discussion of thermal conductivity and rheology. Next, we will detail issues relating to application performance and manufacturing contrasting the differences between pre-formed gaskets as well as non-conducting liquids. We will end with a summary of the most important aspects of thermally conductive liquid materials.

Key insights

Explore significant differences with respect to solid pad like materials and unfilled liquids
Understand the basic structure and properties of thermally conductive materials
Learn about applications contrasting pre-formed gaskets with non-conducting liquids
Get an understanding of most important aspects of thermally conductive liquid materials

Resources

Article
Brochure
Case study
Infographic
White paper

Articles

Upcoming event

Past event

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

...
Articles

Upcoming event

Past event

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

...
Articles

Upcoming event

Past event

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

...
Articles

Upcoming event

Past event

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

...
Articles

Upcoming event

Past event

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

...
Articles

Upcoming event

Past event

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

...

Brochures

Upcoming event

Past event

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

...
Brochures

Upcoming event

Past event

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

...
Brochures

Upcoming event

Past event

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

...
Brochures

Upcoming event

Past event

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

...

Case study

Upcoming event

Past event

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

...
Case study

Upcoming event

Past event

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

...

Upcoming event

Past event

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

...
Upcoming event

Past event

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

...

White Paper

Upcoming event

Past event

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

...
White Paper

Upcoming event

Past event

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

...
White Paper

Upcoming event

Past event

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

...
White Paper

Upcoming event

Past event

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

...

Looking for solutions? We can help

Our experts are here to learn more about your needs.

Request a consultation
Request a sample
Submit an order request

Looking for more support options?

Our support center and experts are ready to help you find solutions for your business needs.

Visit support center

How can thermally conductive liquid materials help for electronics packaging

Get access now

Key insights

Related products

Resources

How advanced materials help slow runaway data center costs

Learn how specifying advanced materials in circuit board construction can help stem rising costs in limited IT budgets.

Your data center is under water and hotter than ever

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling. This is certainly not a new concept. Automobile radiators, one of the first examples of liquid cooling in industry, have existed for nearly 125 years.

Delivering long-term data center sustainability

In this article, we consider the key priorities for delivering data center sustainability, and the steps being taken to meet them.

Does immersion cooling offer a route to the sustainable data center?

This article looks at immersion cooling as one such technology, weighs up its benefits and challenges, and considers whether the drive for data center sustainability will be enough to take it from niche to mainstream adoption.

Honeycomb ventilation for the data center

The honeycomb core-to-vent frame attachment is a critical aspect of data center design, and selecting the right adhesive can contribute to achieving the ultimate sweet spot of balancing performance, cost and product lifetime.

800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

Material solutions for AI data center

Find out about Henkel Adhesive Technologies latest solutions for for AI in data centers

Material solutions for cloud/ hyperscale data center switches, routers and servers

Find out about our latest solutions for cloud/hyperscale data center switches, routers and servers.

Material solutions for wireless infrastructure 5G telecom solutions

Henkel’s advanced bonding and thermal solutions ensure reliable 5G performance in demanding conditions.

High-performance materials for telecom and datacom

Henkel’s advanced materials guarantee reliable, high-speed data transmission through optimized optical alignment, enhanced light transmittance, and superior heat management.

Phase change interface materials for next-gen data center ICs

This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.

Durable TIM coating reduces heat and improves data center switch performance

This case study looks at how durable, thin thermal interface coating reduces heat and improves data center switch performance.

Keep your cool

As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.

Network performance and the butterfly effect

As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.

The heat is on

Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.

Look small to go big

In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.

The 2023 data center pulse report

With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.

The 2024 data center pulse report

The influence of innovation and technology on the need to transition from 800G to 1.6T.

Looking for solutions? We can help

Company

Help

Resource center

Social media