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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Broadband connectivity

Across 5G, enterprise Wi-Fi, and broadband fiber access, broadband connectivity is increasingly challenged to deliver higher processing power, faster speeds, and greater bandwidth. At the same time, costs and power usage are rising, putting pressure on profitability.

Telecommunication tower with 5G cellular network antenna on night city background

At a glance

5G

technology

5G is over 10x faster than 4G.1

26.7%

CAGR

Wi-Fi 6 technology growth estimates 2020-2027.2

87%

of executives believe

Advanced wireless will create competitive advantage.3

Explore our other Data and telecommunication solutions

  • Data center

  • Optical

5G infrastructure solutions

Telecommunications networks, such as 5G, must deliver high speeds with reliable performance, elevating the demand for functional components to new levels. Innovative materials help reduce heat, improve bonding, and protect components. Here's how.

aerial view Cell phone communication antenna  tower with rural countryside landscape

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Resources

  • This is an image of a network cable with fiber optical background

    Keep your cool

    As network scale, speed, and bandwidth needs skyrocket and component density continues to increase, so does the heat generated within those circuits.
    ...
  • This is an image of network cables plugged into a server

    Network performance and the butterfly effect

    As demands for greater bandwidth and faster speeds increase, the stress and strain on networks continues to grow.
    ...

Applications

3D graphic with a frontal view of a remote radio unit exploded to show interior components.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Remote Radio Units and Fixed Wireless Arrays

Telecom infrastructure components are located in outdoor environments, thus ensuring reliable long-term performance is critical. For dependable function, these components rely on strong electrical interconnects and robust thermal management solutions.

3D illustration of a baseband unit all circuir boards exploded to show interior components.
Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Base Stations

To ensure reliable 5G, telecom base stations must provide dependability and longevity. Telecom infrastructure functions in outdoor environments and must withstand environmental conditions, in-operation stress, moisture, and corrosion while maintaining strong electrical interconnects.

3D Graphic of an enterprise wifi 6 indoor access point featuring Henkel's material solutions
Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Enterprise Wi-Fi: Indoor Access Point

Fixed wireless access helps secure fast and seamless connectivity to boost 5G efficiency. The effectiveness of access points depends largely on the materials used to connect electronics, remove operational heat, and secure components.

3D Graphic of an enterprise wifi 6 outdoor access point featuring Henkel's material solutions
Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Enterprise Wi-Fi: Outdoor Access Point

Outdoor wireless access points must withstand environmental stresses as they work to bolster 5G connectivity and efficiency.  The performance of access points relies on the materials used to connect electronics, remove heat, and secure components.

3D graphic with a frontal view of a optical line terminal exploded to show interior components.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

LIQUI-BOND

BERGQUIST® LIQUI-BOND liquid adhesives are high performance, thermally conductive, liquid adhesive materials. These form-in-place elastomers are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink.

BOND-PLY

Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Optical Line Terminal

Optical components, like OLT and ONU, convert electrical signals to fiber optic signals, or vice versa. All optical adhesives must be formulated for maximized light transmittance. In addition, optoelectronic materials must provide high bond strength, minimal shrinkage on cure, and high resistance to humidity.

3D graphic with a frontal view of a optical network unit exploded to show interior components.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

LIQUI-BOND

BERGQUIST® LIQUI-BOND liquid adhesives are high performance, thermally conductive, liquid adhesive materials. These form-in-place elastomers are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink.

BOND-PLY

Available in a pressure sensitive adhesive or laminating format, the BOND-PLY family of materials is thermally conductive and electrically isolating. BOND-PLY facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.

Thermal adhesives

LOCTITE® thermal adhesives are designed to provide excellent heat dissipation for thermally-sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application specific requirements and ease-of-use.

Optical Network Unit

Fiber optic networks use OLT and ONU components at different points in the network to convert signals between electrical and fiber optic. Optoelectronic material must be formulated for maximized light transmittance, high bond strength, minimal shrinkage on cure, and high resistance to humidity.

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