Enhance thermal conductivity and boost your component performance and efficiency with highly conformable thermal GAP PAD® products.
Bergquist® GAP PAD® products are suitable for many electrical applications. Browse the full portfolio of materials to find the right product for your thermal management pad needs. From super soft to harder silicone-free options for a range of applications, find the right gap filler pads for any task with the range of Bergquist® thermal GAP PAD® materials. Explore the full range:
Thermal GAP PAD® materials are soft and highly conformable pads that eliminate air gaps, reduce interface resistance, and provide shock dampening qualities in devices. Thermal GAP PAD® materials can be found in a variety of thickness and hardness options and are available in sheets and die-cut parts. For more details on the qualities and benefits of GAP PAD® materials, please watch the video.
GAP PAD® products are soft, conformable thermal pads that provide effective thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps, and rough surface textures.
Henkel’s Bergquist® GAP PAD® materials are exceptionally simple to use, making them easy to bring into your processes. Our GAP PAD® products are manufactured to size and facilitate easy application. Your operators simply peel the protective film and place the thermal management pad on the desired component.
We offer GAP PAD® products in a variety of standard dimensions and thicknesses to suit a range of applications. Or, if you have specific application requirements, our thermally conductive GAP PAD® materials can be customized.
Available as custom die-cut parts with the ability to individualize thickness and construction, thermally conductive GAP PAD® materials are always fit for purpose to ensure optimized thermal control, no matter the application.
Henkel GAP PAD® products offer shock dampening abilities. This means they are recommended for use in applications that require a minimum amount of pressure between components. You can also find GAP PAD® product options in silicone-free formulations for applications that do not allow silicone, such as silicone-sensitive optic components.
The broad GAP PAD® product family provides an effective thermal interface between heat sinks and electronic devices where textures are present. GAP PAD® thermal materials also offer an extensive thermal conductivity range – going as high as 40.0 W/mK.
At Henkel, we also make sure you are getting the right GAP PAD® product for every application. Our application specialists work closely with customers to specify the proper GAP PAD® material for each unique thermal management requirement.
Reduce thermal resistance
Eliminating air gaps to reduce thermal resistance within assemblies.
Offering ultra-conformable form, with minimal thermal GAP PAD® gap filler compression, low modulus reduces interfacial resistance.
Low-stress vibration dampening
Providing low-stress vibration dampening within assemblies.
Absorbing shock to reduce the risk of damage caused by impact.
Providing easy handling qualities thanks to their solid format.
Offering simplified application. Just peel off the back and place it within the assembly.
Resilience in applications
Puncture, shear, and tear resistance offers added resilience in applications.
Thermal performance for high-heat assemblies
Improving thermal performance for high-heat assemblies.
Deciding which GAP PAD® product you need will depend on the requirements of your application and the components you are assembling. Our GAP PAD® products come in a range of options, including:
- With or without adhesive qualities for use in different types of assembly
- Rubber-coated fiberglass reinforcement for high-stress assemblies
- Thicknesses from 0.010 in. to 0.250 in. to effectively fill any gaps and reduce voids
- Silicone-free thermal GAP PAD® products are available in thicknesses of 0.010 in. to 0.125 in
- Custom die-cut parts, sheets, and rolls (converted or unconverted) to easily fit into your operations
- Custom thicknesses and constructions to suit the needs of any application
- Adhesive or natural inherent tack
- Custom, specialized GAP PAD® materials are available. Tooling charges vary depending on the tolerance and complexity of the part
GAP PAD® thermal interface products are well-suited to a wide variety of industries and applications. They are used across many types of assemblies in electronics, power conversion, telecommunication, automotive, medical, aerospace, and satellite applications, including:
- Between an IC and a heat sink or chassis; typical packages include BGAs, QFPs, SMT power components, and magnetics
- Between a semiconductor and heat sink
- Cooling for memory modules
- In DDR and SD RAM assemblies
- Cooling hard drives and computer parts
- Thermal management of power supplies
- In IGBT modules
- Signal amplifier thermal management
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