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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Fill encapsulants

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  • Packshot for LOCTITE ECCOBOND 3707

    Fill encapsulants

    LOCTITE® ECCOBOND 3707

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    No-flow encapsulant designed for local circuit board protection 

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  • A packshot of LOCTITE ECCOBOND EO1072, a black material in 2 different sizes showing a 30CC syringe and a 10CC syringe.

    Fill encapsulants

    LOCTITE® ECCOBOND EO 1072

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    Epoxy dam and fill encapsulant with excellent handling 

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