Henkel Adhesive Technologies

Henkel Adhesive Technologies

Fill encapsulants

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  • Packshot for LOCTITE ECCOBOND 3707

    Fill encapsulants

    LOCTITE® ECCOBOND 3707

    ...

    No-flow encapsulant designed for local circuit board protection 

  • A packshot of LOCTITE ECCOBOND EO1072, a black material in 2 different sizes showing a 30CC syringe and a 10CC syringe.

    Fill encapsulants

    LOCTITE® ECCOBOND EO 1072

    ...

    Epoxy dam and fill encapsulant with excellent handling 

  • Composite assembly materials

  • Small and large bottles of LOCTITE<sup>®</sup> 402 in a manufacturing facility next to 3D-printed parts.

    Compounds for electronics

  • Industrial adhesives

  • Small and large bottles of LOCTITE<sup>®</sup> 402 in a manufacturing facility next to 3D-printed parts.

    Industrial cleaners

  • Small and large bottles of LOCTITE<sup>®</sup> 402 in a manufacturing facility next to 3D-printed parts.

    Industrial coatings

  • Industrial lubricants

  • Small and large bottles of LOCTITE<sup>®</sup> 402 in a manufacturing facility next to 3D-printed parts.

    Industrial repair materials

  • Small and large bottles of LOCTITE<sup>®</sup> 402 in a manufacturing facility next to 3D-printed parts.

    Industrial sealants

  • Solder materials

  • Surface treatments

  • An example of thermal management materials

    Thermal management materials