Potting compounds

Reactive hotmelt adhesive system for lamination and general assembly work 

Silicone-based B-component to form a foam gasket for, e.g., distance sensors

Two-part, thermally conductive epoxy encapsulant

Curing agent/hardener for use with potting and encapsulating resins

Thermal and mechanical shock resistant silicone

Two-part adhesive for bonding headlight lenses to housing 

Clear, flexible silicone compound

Thermally conductive, 2-part epoxy encapsulant

Self-levelling with long open time

Dual cure, flowable, fluorescent, medium-strength liquid sealant 

One-part, dual-cure adhesive ideal for potting or sealing applications 

Two-part, thermally conductive epoxy encapsulant