Potting compounds

Reactive hotmelt adhesive system for lamination and general assembly work 

Silicone-based potting compound and sealant

Two-part, thermally conductive epoxy encapsulant

Curing agent/hardener for use with potting and encapsulating resins

General-purpose, dielectric-grade epoxy encapsulant

Thermally conductive, 2-part epoxy encapsulant

Polyurethane resin for range of hardeners

Epoxy hardener compatible with a number of LOCTITE^® products

Thermal and mechanical shock resistant silicone

Clear, flexible silicone compound

Self-levelling with long open time

Fast cure, self-leveling silicone liquid