Compounds for electronics

Underfill compatible with small gap sizes

Epoxy encapsulant for protecting bare semiconductor devices 

Low-shrinkage potting compound

Silicone-based part to form a foam gasket for, e.g., distance sensors

Silicone-based part to form a foam gasket for, e.g., distance sensors

Heat- and humidity-resistant, solvent-free potting adhesive 

High-purity encapsulant for applications utilizing lead-free solder

Encapsulant for potting stress-sensitive electronic components

Thermally resistant dam encapsulant for glob top applications

General purpose, dielectric-grade epoxy encapsulant

Halogen-free epoxy underfill

Flame retardant, thermally conductive, non-corrosive potting product