Compounds for electronics

VOC-free conformal coating for metals, ceramic and glass filled epoxy 

Solvent- and CFC-free transparent resin conformal coating

Reactive hotmelt adhesive system for lamination and general assembly

Polyurethane resin for range of hardeners

Silicone-based part to form a foam gasket for, e.g., distance sensors

Silicone-based part to form a foam gasket for, e.g., distance sensors

Low-shrinkage potting compound

Yellow, low viscosity, thermal potting compound

Flame retardant, thermally conductive, non-corrosive potting product 

Halogen-free, low-viscosity reworkable underfill 

Thermally conductive epoxy encapsulant

Thermally conductive epoxy encapsulant