Compounds for electronics

Epoxy encapsulant for protecting bare semiconductor devices 

One-part encapsulant adhesive for ink jet applications 

Reactive hotmelt adhesive system for lamination and general assembly work 

No-flow encapsulant designed for local circuit board protection 

Silicone-based potting compound and sealant

One-part, void-free underfill for very fine area array devices

Two-part, thermally conductive epoxy encapsulant

Curing agent/hardener for use with potting and encapsulating resins

One-part underfill compatible with small gap sizes

General-purpose, dielectric-grade epoxy encapsulant

Thermally conductive, 2-part epoxy encapsulant

Polyurethane resin for range of hardeners