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Henkel Adhesive Technologies
Underfills
LOCTITE® ECCOBOND UF 3711
UV-curable edge bond adhesive for chips
Potting compounds
LOCTITE® STYCAST A 316-48
Heat-resistant epoxy adhesive
TEROSON® PU U333
Heat- and humidity-resistant, solvent-free potting adhesive
TEROSON® PU U632
Adhesive for bonding headlight lenses to housing
SONDERHOFF Fermasil B-33-4
Silicone-based part to form a foam gasket for, e.g., distance sensors
SONDERHOFF Fermasil A-33-4
LOCTITE® SI 5631
Flame retardant, thermally conductive, non-corrosive potting product
Encapsulants
LOCTITE® ECCOBOND FP4450
Epoxy encapsulant for protecting bare semiconductor devices
LOCTITE® ECCOBOND UF 8830S
High purity encapsulant for rigid sealing flip-chip BGAs
LOCTITE® STYCAST 2651
General purpose, dielectric-grade epoxy encapsulant
LOCTITE® SI 5620
Clear, flexible silicone compound
LOCTITE® SI 5623
Thermal and mechanical shock resistant silicone