Compounds for electronics

Epoxy encapsulant for protecting bare semiconductor devices 

Conformal coating providing environmental protection for electronic components 

One-part, void-free underfill for very fine area array devices

One-part encapsulant adhesive for ink jet applications 

One-part underfill compatible with small gap sizes

Epoxy dam and fill encapsulant with excellent handling 

Epoxy hardener compatible with a number of LOCTITE^® products

Thermal and mechanical shock resistant silicone

Clear, flexible silicone compound

Fast cure, self-leveling silicone liquid

No-flow encapsulant designed for local circuit board protection 

Self-levelling with long open time