Compounds for electronics

Long pot life epoxy hardener used for multiple epoxy resins

Thermally conductive, two-part epoxy encapsulant

Low-viscosity, low abrasion, general purpose filled encapsulant  

Thermally conductive epoxy encapsulant

Thermally conductive epoxy encapsulant

Void-free underfill for very fine area array devices

Dual-cure adhesive ideal for potting or sealing applications 

VOC-free conformal coating for metals, ceramic and glass filled epoxy 

High-performance black polyamide with cold temperature flexibility   

Heat-curing epoxy potting compound

Easily reworkable, fast-drying protection layer​ for circuit boards

High-performance black polyamide for high strength and hardness