Compounds for electronics

Epoxy encapsulant for protecting bare semiconductor devices 

High purity encapsulant for applications utilizing lead-free solder

Flexible encapsulant for Pb-free applications

Reactive hotmelt adhesive system for lamination and general assembly work 

Silicone-based B-component to form a foam gasket for, e.g., distance sensors

Two-part, thermally conductive epoxy encapsulant

Curing agent/hardener for use with potting and encapsulating resins

No-flow encapsulant designed for local circuit board protection 

Thermal and mechanical shock resistant silicone

Epoxy dam and fill encapsulant with excellent handling 

Two-part adhesive for bonding headlight lenses to housing 

Polyamide hotmelt for low-pressure molding applications