Encapsulants

High-performance black polyamide with cold temperature flexibility   

High-performance, black polyamide offering high strength and hardness 

High performance thermoplastic polyamide for low-pressure molding 

Two-part adhesive for bonding headlight lenses to housing 

Flame retardant, thermally conductive, non-corrosive potting product 

Reactive hotmelt adhesive system for lamination and general assembly work 

Heat- and humidity resistant, solvent-free potting adhesive 

Polyamide hotmelt for low-pressure molding applications 

Thermally conductive, 2-part epoxy encapsulant

Two-part, thermally conductive epoxy encapsulant

One-part, heat-resistant epoxy adhesive

Two-part, thermally conductive epoxy encapsulant