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Henkel Adhesive Technologies
Potting compounds
LOCTITE® STYCAST A 316-48
Heat-resistant epoxy adhesive
TEROSON® PU U333
Heat- and humidity-resistant, solvent-free potting adhesive
TEROSON® PU U632
Adhesive for bonding headlight lenses to housing
LOCTITE® SI 5631
Flame retardant, thermally conductive, non-corrosive potting product
LOCTITE® STYCAST 2850KT CAT 24LV
Thermally conductive epoxy encapsulant
Encapsulants
LOCTITE® ECCOBOND FP4450
Epoxy encapsulant for protecting bare semiconductor devices
Injection molding compounds
TECHNOMELT® PA 646
High-performance black polyamide for high strength and hardness
LOCTITE® ECCOBOND FIL 7010C
Encapsulant for potting stress-sensitive electronic components
LOCTITE® STYCAST US 2350
Low-viscosity urethane potting compound
LOCTITE® ECCOBOND UF 8830S
High purity encapsulant for rigid sealing flip-chip BGAs
TECHNOMELT® PA 657
High-performance black polyamide with cold temperature flexibility
LOCTITE® ECCOBOND FP4802
High-purity encapsulant for applications utilizing lead-free solder