Encapsulants

Thermally conductive, 2-part epoxy encapsulant

Epoxy hardener compatible with a number of LOCTITE^® products

High-performance, black polyamide offering high strength and hardness 

High-performance black polyamide with cold temperature flexibility   

Polyamide hotmelt for low-pressure molding applications 

Epoxy encapsulant for protecting bare semiconductor devices 

Flame retardant, thermally conductive, non-corrosive potting product 

Two-part, thermally conductive epoxy encapsulant

Two-part, thermally conductive epoxy encapsulant

Reactive hotmelt adhesive system for lamination and general assembly work 

Heat- and humidity resistant, solvent-free potting adhesive 

Two-part adhesive for bonding headlight lenses to housing