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Henkel Adhesive Technologies
Encapsulants
LOCTITE® ECCOBOND FP4450
Epoxy encapsulant for protecting bare semiconductor devices
LOCTITE® ECCOBOND EN 3838T
Flexible encapsulant for Pb-free applications
Potting compounds
TECHNOMELT® PUR 6220 UV
Reactive hotmelt adhesive system for lamination and general assembly
LOCTITE® STYCAST 2850KT CAT 24LV
Thermally conductive epoxy encapsulant
LOCTITE® STYCAST 2850FT BL
LOCTITE® ECCOBOND FP4802
High-purity encapsulant for applications utilizing lead-free solder
LOCTITE® SI 5631
Flame retardant, thermally conductive, non-corrosive potting product
LOCTITE® STYCAST A 316-48
Heat-resistant epoxy adhesive
LOCTITE® ECCOBOND UF 8830S
High purity encapsulant for rigid sealing flip-chip BGAs
TEROSON® PU U333
Heat- and humidity-resistant, solvent-free potting adhesive
LOCTITE® STYCAST HD 3561
Epoxy hardener compatible with several LOCTITE products
Injection molding compounds
TECHNOMELT® PA 657
High-performance black polyamide with cold temperature flexibility