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      • A packshot of LOCTITE ECCOBOND FP4450, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

        Encapsulants

        LOCTITE® ECCOBOND FP4450

        Epoxy encapsulant for protecting bare semiconductor devices 
      • A packshot of LOCTITE ECCOBOND FP4802, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

        Encapsulants

        LOCTITE® ECCOBOND FP4802

        High purity encapsulant for applications utilizing lead-free solder
      • A packshot of LOCTITE ECCOBOND EN 3838T showing black 10, 30, and 55CC syringes.

        Encapsulants

        LOCTITE® ECCOBOND EN 3838T

        Flexible encapsulant for Pb-free applications
      • Individual Packshot for TECHNOMELT PUR 6220 in a black pail

        Potting compounds

        TECHNOMELT® PUR 6220 UV

        Reactive hotmelt adhesive system for lamination and general assembly work 
      • A packshot of LOCTITE STYCAST 2850FT BL in 2 different sizes showing a 1GAL can and a 5GAL pail.

        Potting compounds

        LOCTITE® STYCAST 2850FT BL

        Two-part, thermally conductive epoxy encapsulant
      • Individual Packshot for TEROSON PU U632 in a white pail

        Potting compounds

        TEROSON® PU U632

        Two-part adhesive for bonding headlight lenses to housing 
      • A packshot of TECHNOMELT PA 678 showing a 20KG bag.

        Injection molding compounds

        TECHNOMELT® PA 678

        Polyamide hotmelt for low-pressure molding applications 
      • A packshot of LOCTITE ECCOBOND FIL 7010C in 2 different options showing 20 ounce semco cartridge and a 30cc syringe.

        Encapsulants

        LOCTITE® ECCOBOND FIL 7010C

        Encapsulant for potting stress-sensitive electronic components
      • A packshot of LOCTITE STYCAST 2762FT in 2 different sizes showing a 1GAL can and a 5GAL pail.

        Potting compounds

        LOCTITE® STYCAST 2762FT

        Thermally conductive, 2-part epoxy encapsulant
      • Packshot for LOCTITE STYCAST 2850KT BL

        Potting compounds

        LOCTITE® STYCAST 2850KT CAT 24LV

        Two-part, thermally conductive epoxy encapsulant
      • A packshot of LOCTITE ECCOBOND DAM 7010C in 2 different options showing 20 ounce semco cartridge and a 30cc syringe.

        Encapsulants

        LOCTITE® ECCOBOND DAM 7010C

        Thermally resistant dam encapsulant for glob top applications
      • A packshot of LOCTITE ECCOBOND UV 9052, black UV syringes in 3 different sizes showing a 55CC syringe, a 30CC syringe, and a 10CC syringe.

        Encapsulants

        LOCTITE® ECCOBOND UV 9052

        One-part encapsulant adhesive for ink jet applications 

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