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Henkel Adhesive Technologies
Encapsulants
LOCTITE® ECCOBOND FP4450
Epoxy encapsulant for protecting bare semiconductor devices
Injection molding compounds
TECHNOMELT® PA 646
High-performance black polyamide for high strength and hardness
Potting compounds
TEROSON® PU U333
Heat- and humidity-resistant, solvent-free potting adhesive
LOCTITE® ECCOBOND FP4802
High-purity encapsulant for applications utilizing lead-free solder
LOCTITE® ECCOBOND FIL 7010C
Encapsulant for potting stress-sensitive electronic components
LOCTITE® ECCOBOND DAM 7010C
Thermally resistant dam encapsulant for glob top applications
LOCTITE® SI 5631
Flame retardant, thermally conductive, non-corrosive potting product
LOCTITE® ECCOBOND UF 8830S
High purity encapsulant for rigid sealing flip-chip BGAs
LOCTITE® STYCAST 2850KT CAT 24LV
Thermally conductive epoxy encapsulant
LOCTITE® STYCAST US 2350
Low-viscosity urethane potting compound
LOCTITE® STYCAST HD 3561
Epoxy hardener compatible with several LOCTITE products
LOCTITE® ECCOBOND UV 9052
Encapsulant adhesive for ink jet applications