Encapsulants

Epoxy encapsulant for protecting bare semiconductor devices 

One-part encapsulant adhesive for ink jet applications 

Reactive hotmelt adhesive system for lamination and general assembly work 

Two-part, thermally conductive epoxy encapsulant

High performance thermoplastic polyamide for low-pressure molding 

Two-part, thermally conductive epoxy encapsulant

Thermally conductive, 2-part epoxy encapsulant

Flame retardant, thermally conductive, non-corrosive potting product 

Low-viscosity, urethane potting compound

One-part, heat-resistant epoxy adhesive

High-performance black polyamide with cold temperature flexibility   

High-performance, black polyamide offering high strength and hardness