Skip to Content
Henkel Adhesive Technologies
Recent searches

      Henkel Adhesive Technologies

      Encapsulants

      Filters

      $
      $
      • A packshot of LOCTITE ECCOBOND FP4450, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

        Encapsulants

        LOCTITE® ECCOBOND FP4450

        Epoxy encapsulant for protecting bare semiconductor devices 
      • A packshot of LOCTITE ECCOBOND EN 3838T showing black 10, 30, and 55CC syringes.

        Encapsulants

        LOCTITE® ECCOBOND EN 3838T

        Flexible encapsulant for Pb-free applications
      • Individual Packshot for TECHNOMELT PUR 6220 in a black pail

        Potting compounds

        TECHNOMELT® PUR 6220 UV

        Reactive hotmelt adhesive system for lamination and general assembly
      • Packshot for LOCTITE STYCAST 2850KT BL

        Potting compounds

        LOCTITE® STYCAST 2850KT CAT 24LV

        Thermally conductive epoxy encapsulant
      • A packshot of LOCTITE STYCAST 2850FT BL in 2 different sizes showing a 1GAL can and a 5GAL pail.

        Potting compounds

        LOCTITE® STYCAST 2850FT BL

        Thermally conductive epoxy encapsulant
      • A packshot of LOCTITE ECCOBOND FP4802, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

        Encapsulants

        LOCTITE® ECCOBOND FP4802

        High-purity encapsulant for applications utilizing lead-free solder
      • Individual Packshot for LOCTITE SI 5631 in a black bucket

        Potting compounds

        LOCTITE® SI 5631

        Flame retardant, thermally conductive, non-corrosive potting product 
      • A packshot of LOCTITE STYCAST A 316-48 in 2 different sizes showing a 1GAL can and a 5GAL pail.

        Potting compounds

        LOCTITE® STYCAST A 316-48

        Heat-resistant epoxy adhesive
      • A packshot of LOCTITE ECCOBOND UF 8830S, a black material in 2 different sizes showing a 30CC syringe and a 10CC syringe.

        Encapsulants

        LOCTITE® ECCOBOND UF 8830S

        High purity encapsulant for rigid sealing flip-chip BGAs
      • Individual Packshot for TEROSON PU U333 in a black pail

        Potting compounds

        TEROSON® PU U333

        Heat- and humidity-resistant, solvent-free potting adhesive 
      • A packshot of LOCTITE STYCAST HD 3561 in 2 different sizes showing a 1GAL can and a 5GAL pail.

        Potting compounds

        LOCTITE® STYCAST HD 3561

        Epoxy hardener compatible with several LOCTITE products
      • A packshot of TECHNOMELT PA 657 showing a 20KG bag.

        Injection molding compounds

        TECHNOMELT® PA 657

        High-performance black polyamide with cold temperature flexibility   

      Henkel Adhesive Technologies
      Company
      About us
      Locations
      Careers
      News
      Current Customer eShop
      Sustainability
      Help
      FAQs
      Find a TDS
      Find a SDS
      Find a distributor
      Contact us
      Resource center
      Product search
      Technical Library
      Case studies
      White papers
      Webinars
      Brochures
      Social media
      ⓒ 2025 Henkel Corporation. ALL RIGHTS RESERVED
      You are on a United States website