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Henkel Adhesive Technologies
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Henkel Adhesive Technologies
Encapsulants
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Encapsulants
LOCTITE® ECCOBOND FP4450
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Epoxy encapsulant for protecting bare semiconductor devices
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Encapsulants
LOCTITE® ECCOBOND EN 3838T
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Flexible encapsulant for Pb-free applications
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Encapsulants
LOCTITE® ECCOBOND DAM 7010C
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Thermally resistant dam encapsulant for glob top applications
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Potting compounds
TECHNOMELT® PUR 6220 UV
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Reactive hotmelt adhesive system for lamination and general assembly
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Potting compounds
LOCTITE® STYCAST 2850KT CAT 24LV
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Thermally conductive epoxy encapsulant
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Potting compounds
LOCTITE® STYCAST 2850FT BL
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Thermally conductive epoxy encapsulant
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Potting compounds
LOCTITE® STYCAST 2762FT
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Thermally conductive epoxy encapsulant
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Encapsulants
LOCTITE® ECCOBOND FIL 7010C
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Encapsulant for potting stress-sensitive electronic components
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Potting compounds
TEROSON® PU U632
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Adhesive for bonding headlight lenses to housing
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Encapsulants
LOCTITE® ECCOBOND FP4802
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High-purity encapsulant for applications utilizing lead-free solder
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Potting compounds
LOCTITE® STYCAST HD 3561
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Epoxy hardener compatible with several LOCTITE products
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Injection molding compounds
TECHNOMELT® PA 646
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High-performance black polyamide for high strength and hardness