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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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  • A packshot of LOCTITE STYCAST A 316-48 in 2 different sizes showing a 1GAL can and a 5GAL pail.

    Potting compounds

    LOCTITE® STYCAST A 316-48

    Heat-resistant epoxy adhesive

  • Individual Packshot for TEROSON PU U333  in a black pail

    Potting compounds

    TEROSON® PU U333

    Heat- and humidity-resistant, solvent-free potting adhesive 

  • Individual Packshot for TEROSON PU U632 in a white pail

    Potting compounds

    TEROSON® PU U632

    Adhesive for bonding headlight lenses to housing 

  • Individual Packshot for LOCTITE SI 5631 in a black bucket

    Potting compounds

    LOCTITE® SI 5631

    Flame retardant, thermally conductive, non-corrosive potting product 

  • Packshot for LOCTITE STYCAST 2850KT BL

    Potting compounds

    LOCTITE® STYCAST 2850KT CAT 24LV

    Thermally conductive epoxy encapsulant

  • A packshot of LOCTITE ECCOBOND FP4450, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

    Encapsulants

    LOCTITE® ECCOBOND FP4450

    Epoxy encapsulant for protecting bare semiconductor devices 

  • A packshot of TECHNOMELT PA 646 BLACK showing a 20KG bag.

    Injection molding compounds

    TECHNOMELT® PA 646

    High-performance black polyamide for high strength and hardness 

  • A packshot of LOCTITE ECCOBOND FIL 7010C in 2 different options showing 20 ounce semco cartridge and a 30cc syringe.

    Encapsulants

    LOCTITE® ECCOBOND FIL 7010C

    Encapsulant for potting stress-sensitive electronic components

  • A packshot of LOCTITE STYCAST US 2350 in 2 parts showing 2 1GAL cans and 2 5GAL pails.

    Potting compounds

    LOCTITE® STYCAST US 2350

    Low-viscosity urethane potting compound

  • A packshot of LOCTITE ECCOBOND UF 8830S, a black material in 2 different sizes showing a 30CC syringe and a 10CC syringe.

    Encapsulants

    LOCTITE® ECCOBOND UF 8830S

    High purity encapsulant for rigid sealing flip-chip BGAs

  • A packshot of TECHNOMELT PA 657 showing a 20KG bag.

    Injection molding compounds

    TECHNOMELT® PA 657

    High-performance black polyamide with cold temperature flexibility   

  • A packshot of LOCTITE ECCOBOND FP4802, a black material in 3 different sizes showing a 6OZ semco cartridge, a 30CC syringe, and a 10CC syringe.

    Encapsulants

    LOCTITE® ECCOBOND FP4802

    High-purity encapsulant for applications utilizing lead-free solder