Packaging is a crucial determinant of power, performance and cost. New packaging requirements--thinner wafers, smaller footprints, package integration, 3D designs and wafer-level technology--deliver higher performing microelectronics. Cutting-edge materials enable wirebond and advanced semiconductor packaging applications.
Automotive, communications, and data centers demand more performance from semiconductor technology. As size decreases, performance must increase. Henkel materials are helping elevate semiconductor packaging to meet these needs.
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Printable die attach materials provide a viable alternative to standard die attach paste processes, allowing the application of adhesive at the wafer-level.
Strong die-to-substrate and die-to-die bonds are the foundation of robust semiconductor packages.
Protection of ICs, particularly as dimensions continue to shrink and more direct chip attach is incorporated, is critical for long-term semiconductor device reliability.
Die attach film adhesives have become essential for the production of next-generation semiconductor packages.
Wirebonding is a stronghold of semiconductor technology, providing flexibility and cost advantages within an established infrastructure. New automotive applications are fueling growth in wirebond packaging.
Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in mobility products, consumer electronics, data processing and IoT applications, among others.
The convergence of advanced RF communication capability, miniaturization and package-level integration underscore the requirement for novel approaches to EMI shielding.
Higher I/O counts, package integration and tighter bump pitches are dictating the use of flip-chip technology to enable advanced package designs.
Advanced flip-chip technology and heterogeneous integration are key enablers of high-performance computing, driving new levels of processing power for desktops, data center servers, autonomous driving systems, and more.
Advanced packaging techniques meet intensifying demands for applications like flip chip, wafer-level packaging, and memory 3D TSVs. With miniaturized form factor and processing power, advanced packaging enables system level integration, higher functionality, and faster performance.
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