Semiconductors and their novel packaging designs are digitizing our world. From automobiles to data centers, smartphones and 5G infrastructure, semiconductor packaging innovation is at the core of responsive, reliable, robust electronic functionality. That means semiconductors must deliver higher performance, smaller size, unfailing reliability and lower cost.
Semiconductor performance must do more in smaller, intricate, packaging designs. Innovative materials are enabling semiconductors to deliver next-gen capabilities across data centers, telecommunications, and automotive industries.
New requirements, such as mobile electronics, demand higher performance in smaller semiconductor packages. Material innovations enable packaging architectures and manufacturing efficiencies in areas such as thinner wafers, smaller footprints, finer pitches, package integration, 3D designs, wafer-level technology.
Semiconductor technologies power communications, vehicles, and other critical applications, mandating unfailing reliability. From die-attach adhesives for wirebond packaging to advanced underfills and encapsulants for advanced packaging, cutting-edge materials and global support help microelectronic companies meet rising demands.
Artificial intelligence (AI) and high performance computing (HPC) are escalating semiconductor performance requirements. Advanced materials help meet next-level needs and enable AI and HPC applications across industries and in data centers.
As chips become smaller, faster and more complex, packaging plays an increasingly critical role in what comes next. Explore the Gallery of Progress and see how packaging technologies and materials have evolved to support semiconductor performance.
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Henkel offers semiconductor packaging materials for wirebond and advanced semiconductor package assembly. Wirebond package materials include die attach pastes and films, sintering pastes and encapsulants. These materials bond the die to the substrate, provide thermal management capability, and improve reliability. Advanced packaging materials include underfills, wafer level encapsulants, and lid and stiffener attach adhesives. These materials help to ensure package stability and enable the complex, higher-density designs of next-generation devices and applications.
Mechanical protection: As devices get smaller and more densely packed, advanced materials are needed at the package level to protect against mechanical stress and impact.
Thermal management: As next-generation high-power devices introduce increasing demands for complex, high-density packages, semiconductor packaging materials are needed to dissipate heat to ensure optimal performance and package reliability.
Electrical connection: Some semiconductor packaging materials provide electrical conductivity to transmit power and data signals between the die and external circuits.
Advanced underfills: Semiconductor-grade underfills improve interconnect reliability and protect against thermal-mechanical stress, guarding against factors like warpage and die cracking that can render an entire device inoperable.
Wafer-level encapsulants: Advanced molding and encapsulation materials provide improved handling, protection, and warpage control for thin dies.
Lid and stiffener attach adhesives: Semiconductor adhesives reliably bond lids and peripheral stiffeners to the substrate, allowing the package to maintain flatness throughout production and operational thermal cycles.
The intense compute workloads of AI cloud and data center processors require advanced devices that continuously demand high power to manage high bandwidth workloads efficiently. Complex, higher density packages are susceptible to intense operational heat and mechanical stress. Advanced semiconductor packaging materials like thermal interface materials, underfills, and advanced adhesives help fortify and stabilize these complex packages.
Henkel supports customer innovation through a combination of advanced material expertise, application engineering, and co-innovation with customers.
Beyond materials, Henkel works closely with customers to address design, manufacturing, reliability, and performance challenges through modeling and simulation, reliability validation, regulatory support, and technical problem solving.
Through its network of innovation centers and laboratories, Henkel works alongside customers to evaluate concepts, validate solutions, and address emerging application challenges.
By combining material science, engineering know-how, and insights from across the electronics value chain, Henkel helps customers transform ideas into reliable, scalable products with greater confidence.
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