Underfills provide mechanical reinforcement to extend the lifespan of delicate electronic packages. With fast cure, room temperature flowability, re-workability, and high reliability and excellent SIR performance, underfills help streamline manufacturing processes.
Packaging is a crucial determinant of power, performance and cost. New packaging requirements--thinner wafers, smaller footprints, package integration, 3D designs and wafer-level technology--deliver higher performing microelectronics. Cutting-edge materials enable wirebond and advanced semiconductor packaging applications.
Automotive, communications, and data centers demand more performance from semiconductor technology. As size decreases, performance must increase. Henkel materials are helping elevate semiconductor packaging to meet these needs.
- Wirebond semiconductor packaging
- Advanced semiconductor packaging
Printable die attach materials provide a viable alternative to standard die attach paste processes, allowing the application of adhesive at the wafer-level.
Strong die-to-substrate and die-to-die bonds are the foundation of robust semiconductor packages.
Protection of ICs, particularly as dimensions continue to shrink and more direct chip attach is incorporated, is critical for long-term semiconductor device reliability.
Die attach film adhesives have become essential for the production of next-generation semiconductor packages.
Wirebonding is a stronghold of semiconductor technology, providing flexibility and cost advantages within an established infrastructure. New automotive applications are fueling growth in wirebond packaging.
Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in mobility products, consumer electronics, data processing and IoT applications, among others.
The convergence of advanced RF communication capability, miniaturization and package-level integration underscore the requirement for novel approaches to EMI shielding.
Higher I/O counts, package integration and tighter bump pitches are dictating the use of flip-chip technology to enable advanced package designs.
Advanced flip-chip technology and heterogeneous integration are key enablers of high-performance computing, driving new levels of processing power for desktops, data center servers, autonomous driving systems, and more.
Advanced packaging techniques meet intensifying demands for applications like flip chip, wafer-level packaging, and memory 3D TSVs. With miniaturized form factor and processing power, advanced packaging enables system level integration, higher functionality, and faster performance.
Wafer-level packaging enable innovations in mobility, consumer electronics, data processing and IoT applications. Wafer-level encapsulation provides stability, protection, and reliability.
Advanced flip-chip technology is enabling new levels of processing performance while increasing the demands on semiconductor packaging design. Lid and stiffener attach adhesives prevent stability- and reliability-reducing warpage from thermal and mechanical stress.
Novel approaches to EMI shielding are required to support the convergence of advanced RF communication capability, miniaturization, and package-level integration.
As electronic devices become smaller, die-attach pastes help manage the increasing challenges of thermal management, structural integrity, and electrical performance.
Die-attach films provide the required performance of smaller, thinner, and more reliable devices. In addition, die attach film adhesives are thin, quick curing and apply easily in small spaces.
Encapsulants protect integrated circuits against particles, heat, moisture, and other external factors to provide long-term semiconductor device reliability. Dam and fill solutions offer a range of products and application and manufacturing options.
Printable die attach materials allow application of adhesive at the wafer-level and protect against die chipping, cracking, warpage and package damage while also facilitate high-yield processing.
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