Die attach adhesives
Conductive die-attach adhesive for high-reliability package applications
This 1-part, epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-reliability package applications and bonds to various metal surfaces.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK ABP 6389 is a silver, thermally and electrically conductive die attach adhesive for high-reliability package applications, typically SOIC, SOP, QFP and QFN packages. It offers robust bonding of small to large die on a wide array of metal surfaces, including Cu, Ag and PPF lead frames and is engineered to bond with or without BSM (Back Side Metallization) die. It offers good thermal conductivity for heat management and excellent electrical conductivity to achieve low ON Resistance (RDS(ON)) in MOSFET devices. LOCTITE ABLESTIK ABP 6389 is formulated with an epoxy-based resin and cures when exposed to heat.
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Good adhesion to Cu, Ag and PPF
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Good workability
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High reliability
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High thermal conductivity
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Good electrical conductivity
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
