Part no. (SKU/IDH):
2832958
IDH Name:
LOCTITE® ABLESTIK ABP 6395T, 10 cc Syringe
${product.sortedProductCategories1}
Conductive die-attach adhesive for high-reliability package applications
A 1-part, epoxy-based, thermally and electrically conductive die-attach adhesive designed for high-reliability package applications and bonds to various metal surfaces.
Marketing materials
Part no. (SKU/IDH):
2832958
IDH Name:
LOCTITE® ABLESTIK ABP 6395T, 10 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Question & answer
LOCTITE® ABLESTIK ABP 6395T is a silver, thermally and electrically conductive die attach adhesive for high-reliability package applications, typically SOIC, SOP, QFP and QFN packages. It offers robust bonding of small to large die on a wide array of metal surfaces, including Cu, Ag and PPF lead frames, and is engineered to bond with or without BSM (Back Side Metallization) die. It offers good thermal conductivity for heat management and excellent electrical conductivity to achieve low ON Resistance (RDS(ON)) in MOSFET devices. It’s formulated with an epoxy-based resin and cures when exposed to heat.
-
Good adhesion to Cu, Ag and PPF
-
Good workability
-
High reliability
-
High thermal conductivity
-
Good electrical conductivity
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.