If versatile, efficient, easy-to-process protection is the objective, Henkel’s TECHNOMELT and LOCTITE low pressure molding materials are the solution. Simple three-step molding can be achieved in seconds, encapsulating and safeguarding even the most delicate electronics.
Low pressure molding materials are polyamide- and polyolefin-based hot melts used to overmold electronic devices, creating a self-contained housing. Once encapsulated, parts can be handled immediately. Low pressure molding has unlimited design possibilities for numerous applications, including LEDs, connectors, cables and wires, sensors, and other electronic devices.
Low pressure molding enables short processing times and ties into LEAN manufacturing concepts. The overmolded parts are waterproof, resistant to vibration and impact, and protected from corrosion and many chemicals. Low waste, environmental friendliness, and cost-effectiveness are also why low pressure molding is widely used.
Fast, simple processing
Ideal for all electronic devices
Sustainable
Low pressure molding materials are selected based on the specific formulation characteristics required to meet application end use and processing conditions. These include material softening point, application operating temperature, environmental temperature, viscosity, UV resistance requirements, and substrate compatibility.
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