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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Hot melt adhesives


High performance, solvent-free polyamide for high-temperature applications  

This black, low viscosity, high-performance polyamide hotmelt adhesive is designed for low pressure molding applications and incidental solvent exposure. Perfect for higher temperature applications, such as automotive underhood.  

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

TECHNOMELT® PA 673, 20 kg Big bag



TECHNOMELT® PA673 is an amber-colored, high performance thermoplastic polyamide specially designed to meet low pressure molding process requirements. It has a very short open time, and can be processed at low pressure due to its low viscosity, allowing encapsulation of fragile components without damage. Perfect for use in automotive underhood applications, where high service temperature performance is critical. Operating temperature is -40°F to 437°F. 

Product category:

Hot melt adhesives





0.98 g/cm³

Melt viscosity, RVT, ASTM D 3236, @ 210.0 °C:

2800.0 mPa·s - 4000.0 mPa·s

Softening point temperature:

185.0 °C

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