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Henkel Adhesive Technologies
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
Phase change materials
BERGQUIST® HI FLOW THF 1600G
Electrically insulating reinforced pad
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable pad combining thermal dissipation and EMI absorption
LOCTITE® TCP 4000D
Dispensable paste - low thermal impedance
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
Thermal gels
BERGQUIST® LIQUI FORM TLF 10000
High-performance thermal interface gel for telecom market applications
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad
BERGQUIST® GAP PAD® TGP 3004SF
Soft, electrically insulating pad - silicone free
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 4000
Versatile, high performance, dispensable liquid
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength activator-cured paste
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
