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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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  • Packshot for black adhesive of LOCTITE ABLESTIK TE 3530 in 3cc, 5cc, 10cc, 30cc

    Thermally conductive adhesives

    LOCTITE® ABLESTIK TE 3530

    Thermally conductive epoxy adhesive for heat dissipation components

  • A packshot of BERGQUIST HI FLOW THF 1600G showing green sheets, die cuts, and die cut roll.

    Phase change materials

    BERGQUIST® HI FLOW THF 1600G

    Electrically insulating reinforced pad

  • A packshot of BERGUIST microTIM mTIM 1013 showing a heat sink with a tan microTIM film.

    Thermally conductive films

    BERGQUIST® microTIM mTIM 1013

    Durable micro-thermal interface coating for pluggable optical modules

  • A packshot of BERGQUIST GAP PAD TGP 3000ULM showing a grey gap pad.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 3000ULM

    Soft, fiberglass reinforced, electrically insulating pad

  • A packshot of BERGQUIST HI FLOW THF 3000UT showing light blue tabulated parts on a roll.

    Phase change materials

    BERGQUIST® HI FLOW THF 3000UT

    Easy-to-use tabulated pad

  • A packshot of BERGQUIST GAP PAD TGP 7000ULM showing grey sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 7000ULM

    Extremely soft, high performance electrically insulating pad

  • A packshot of BERGQUIST GAP PAD TGP 6000ULM showing grey sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 6000ULM

    Soft, high performance electrically insulating pad

  • A packshot of BERGQUIST GAP PAD TGP 3500ULM showing grey sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 3500ULM

    Soft, fiberglass reinforced, electrically insulating pad

  • A packshot of BERGQUIST GAP FILLER TGF 1500 showing yellow and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1500

    Versatile, cost-effective dispensable liquid

  • A packshot of BERGQUIST GAP PAD TGP 10000ULM showing a grey gap pad.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 10000ULM

    Soft, electrically insulating pad with exceptional thermal conductivity

  • A packshot of BERGQUIST LIQUI FORM TLF 6000HG showing a grey 600CC cartridge.

    Thermal gels

    BERGQUIST® LIQUI FORM TLF 6000HG

    For telecom market applications requiring high gap fill

  • A packshot of BERGQUIST GAP FILLER TGF 4000 showing blue and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 4000

    Versatile, high performance, dispensable liquid