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Henkel Adhesive Technologies
SONDERHOFF dosing machines
SONDERHOFF® Dosing Cell 3E PUR
Mixing and dosing machine for processing 2-part PUR systems
SONDERHOFF® Dosing Cell 3E FLEX
Mixing and dosing machine customizable for processing 2-part PUR or SIL systems
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable, micro-thermal interface coatings for pluggable optical modules
Thermal GAP PAD Materials
BERGQUIST® GAP PAD TGP 3004SF
Soft, electrically insulating pad - silicone free
Phase change materials
BERGQUIST® HI FLOW THF 1600G
Electrically insulating, reinforced pad
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
BERGQUIST® GAP PAD TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA2005RT
Dispensable liquid for structural component bonding - high performance
BERGQUIST® GAP PAD TGP 3000ULM
Soft, fiberglass reinforced electrically insulating pad
LOCTITE® ABLESTIK TE 3530
Thermally-conductive epoxy adhesive for heat dissipation components
