Thermal GAP PAD Materials
Soft, electrically insulating pad - silicone free
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
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- Technical specification
BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. This product has no silicone content and is therefore ideal for silicone sensitive applications.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
0.25 mil PET Film
Density, Maximum Final:
-40.0 °C - 125.0 °C
Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, @ 23.0 °C:
0.254 mm - 3.715 mm