Part no. (SKU/IDH):
2214008
IDH Name:
BERGQUIST® GAP PAD® TGP 3004SF
Thermal GAP PAD Materials
Soft, electrically insulating pad - silicone free
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.
Marketing materials
Part no. (SKU/IDH):
2214008
IDH Name:
BERGQUIST® GAP PAD® TGP 3004SF
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone-sensitive applications.
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Thermal conductivity: 3.0 W/m-K
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Silicone-free formulation
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UL94 V-0 compliant
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Reworkable
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Sil pads
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Gap pads
- Carrier type:
- 0.25 mil PET film
- Color:
- Light gray
- Density, Maximum Final:
- 3.2 g/cm³
- Flame rating:
- V-0
- Operating temperature:
- -40.0 °C - 125.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, @ 23.0 °C:
- 70.0
- Standard thickness:
- 0.254 mm - 3.715 mm
- Thermal conductivity:
- 3.0 W/mK
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Large volume or special order?
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