Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials


Soft, electrically insulating pad - silicone free

A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.

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BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. This product has no silicone content and is therefore ideal for silicone sensitive applications.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Carrier type:

0.25 mil PET Film


Light Gray

Density, Maximum Final:

3.2 g/cm³

Flame rating:


Operating temperature:

-40.0 °C - 125.0 °C

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, @ 23.0 °C:


Standard thickness:

0.254 mm - 3.715 mm

Thermal conductivity:

3.0 W/mK

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