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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 3004SF

Soft, electrically insulating pad - silicone free

A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.

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Information

BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.

Carrier type:

0.25 mil PET film

Color:

Light gray

Density, Maximum Final:

3.2 g/cm³

Flame rating:

V-0

Operating temperature:

-40.0 °C - 125.0 °C

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, @ 23.0 °C:

70.0

Standard thickness:

0.254 mm - 3.715 mm

Thermal conductivity:

3.0 W/mK

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