Thermal GAP PAD Materials
Soft, electrically insulating pad - silicone free
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Thermal conductivity: 3.0 W/m-K
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Silicone-free formulation
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UL94 V-0 compliant
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Reworkable
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, sil pads
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Thermal management, gap pads
- Carrier type:
- 0.25 mil PET film
- Color:
- Light gray
- Density, Maximum Final:
- 3.2 g/cm³
- Flame rating:
- V-0
- Operating temperature:
- -40.0 °C - 125.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, @ 23.0 °C:
- 70.0
- Standard thickness:
- 0.254 mm - 3.715 mm
- Thermal conductivity:
- 3.0 W/mK
