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Henkel Adhesive Technologies
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
Thermal GAP PAD Materials
BERGQUIST® GAP PAD TGP 3004SF
Soft, electrically insulating pad - silicone free
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
BERGQUIST® GAP PAD TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
BERGQUIST® GAP PAD TGP 10000ULM
Soft, electrically insulating pad - exceptional thermal conductivity
Thermally conductive adhesives
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength, activator-cured paste
BERGQUIST® GAP FILLER TGF 3500LVO
High performance dispensable liquid with low outgassing
BERGQUIST® GAP PAD® TGP HC5000
Soft, fiberglass-reinforced insulation pad - high performance
BERGQUIST® GAP PAD TGP 6000ULM
Soft, electrically insulating pad - high performance
BERGQUIST® GAP FILLER TGF 4000
Versatile, high performance, dispensable liquid gap filler
