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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST® GAP FILLER TGF 3500LVO

High performance dispensable liquid with low outgassing

A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2168254

BERGQUIST® GAP FILLER TGF 3500LVO, 50 ml Dual cartridge

Documents

Information

BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The ultra-conforming feature combined with its low volatility makes it the ideal solution for use in medical electronics and other fragile or low stress assemblies such as Optics and Automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components and will cure at room temperature or can be sped up with the addition of heat. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Product category:

Thermal gap fillers

Technologies:

Cure type:

Heat cure

Flame rating:

V-0

Hardener: Color:

White

Mixed: Color:

Light blue

Operating temperature:

-60.0 °C - 200.0 °C

Resin: Color:

Blue

Thermal conductivity:

3.5 W/mK

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