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Henkel Adhesive Technologies
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 4000
Versatile, high performance, dispensable liquid
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA3500
Dispensable liquid for structural component bonding - extreme environments
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable pad combining thermal dissipation and EMI absorption
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft, electrically insulating pad with exceptional thermal conductivity
BERGQUIST® GAP PAD® TGP 6000ULM
Soft, high performance electrically insulating pad
BERGQUIST® GAP PAD® TGP 10000ULM
Soft, electrically insulating pad with exceptional thermal conductivity
BERGQUIST® GAP FILLER TGF 3500LVO
High-performance dispensable liquid with low outgassing
BERGQUIST® GAP PAD® TGP 7000ULM
Extremely soft, high performance electrically insulating pad
BERGQUIST® GAP PAD® TGP HC5000
Soft, fiberglass-reinforced insulation pad - high-performance
