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Henkel Adhesive Technologies
SONDERHOFF dosing machines
SONDERHOFF® Dosing Cell 3E PUR
Mixing and dosing machine for processing 2-part PUR systems
SONDERHOFF® Dosing Cell 3E FLEX
Mixing and dosing machine customizable for processing 2-part PUR or SIL systems
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
BERGQUIST® GAP PAD TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
Thermal gels
BERGQUIST® LIQUI FORM TLF LF3500
For demanding, stay-in-place applications
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
BERGQUIST® GAP PAD TGP 7000ULM
Extremely soft, electrically insulating pad - high performance
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid gap filler
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength, activator-cured paste
BERGQUIST® GAP FILLER TGF 3500LVO
High performance dispensable liquid with low outgassing
