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Henkel Adhesive Technologies
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft, electrically insulating pad with exceptional thermal conductivity
BERGQUIST® GAP PAD® TGP 3500ULM
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA3500
Dispensable liquid for structural component bonding - extreme environments
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® GAP PAD® TGP 10000ULM
Soft, electrically insulating pad with exceptional thermal conductivity
BERGQUIST® GAP PAD® TGP HC5000
Soft, fiberglass-reinforced insulation pad - high-performance
BERGQUIST® GAP PAD® TGP HC3000
Soft, fiberglass-reinforced insulation pad for low stress applications
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
