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Henkel Adhesive Technologies
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 4000
Versatile, high performance, dispensable liquid
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad
Thermally conductive adhesives
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength activator-cured paste
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® LIQUI BOND TLB SA3500
Dispensable liquid for structural component bonding - extreme environments
BERGQUIST® GAP PAD® TGP 3500ULM
BERGQUIST® GAP FILLER TGF 3500LVO
High-performance dispensable liquid with low outgassing
BERGQUIST® GAP PAD® TGP 6000ULM
Soft, high performance electrically insulating pad
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid
