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Henkel Adhesive Technologies
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable, micro-thermal interface coatings for pluggable optical modules
Phase change materials
BERGQUIST® HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
Thermal GAP PAD Materials
BERGQUIST® GAP PAD TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
BERGQUIST® GAP PAD TGP 3000ULM
Soft, fiberglass reinforced electrically insulating pad
Thermal gels
BERGQUIST® LIQUI FORM TLF LF3500
For demanding, stay-in-place applications
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® GAP PAD TGP 7000ULM
Extremely soft, electrically insulating pad - high performance
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid gap filler
BERGQUIST® GAP PAD TGP 3500ULM
BERGQUIST® GAP FILLER TGF 3500LVO
High performance dispensable liquid with low outgassing
LOCTITE® 315
Self-shimming, thermally conductive, controlled-strength, activator-cured paste