Thermally conductive adhesives
Dispensable liquid adhesive for structural component bonding - high strength
Silicone free, 2-part epoxy liquid for applications where mechanical and chemical stability is needed.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2194122
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB EA1800 is a thermally conductive epoxy liquid adhesive withs excellent chemical and mechanical stability. The product cures at room temperature and creates a high bond strength which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Thermal conductivity: 1.8 W/m-K (ASTM D5470)
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High bond strength, room temperature cure
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Silicone-free
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Accelerated cure through heat
Flame rating:
V-0
Hardener: Color:
Light Yellow
Operating temperature:
-40.0 °C - 125.0 °C
Resin: Color:
Gray
Thermal conductivity:
1.8 W/mK
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