Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermally conductive adhesives


Dispensable liquid adhesive for structural component bonding - high strength

Silicone free, 2-part epoxy liquid for applications where mechanical and chemical stability is needed.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

BERGQUIST LIQUI BOND TLB EA1800, 50 ml Dual cartridge

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BERGQUIST® LIQUI BOND TLB EA1800 is a thermally conductive epoxy liquid adhesive withs excellent chemical and mechanical stability. The product cures at room temperature and creates a high bond strength which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Flame rating:


Hardener: Color:

Light Yellow

Operating temperature:

-40.0 °C - 125.0 °C

Resin: Color:


Thermal conductivity:

1.8 W/mK

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