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Henkel Adhesive Technologies
Underfills
LOCTITE® ECCOBOND FP4531
Underfill compatible with small gap sizes
LOCTITE® ECCOBOND UF 9000AG
Underfill encapsulant for flip-chip BGA and Cu pillars
LOCTITE® ECCOBOND UF 1173
Void-free epoxy underfill
LOCTITE® ECCOBOND UF 3831
Halogen-free epoxy underfill
LOCTITE® ECCOBOND UF 3812
Epoxy underfill with excellent thermal performance
LOCTITE® ECCOBOND E 1172 A
Void-free underfill for very fine area array devices
LOCTITE® 3517M
Black epoxy underfill for preventing mechanical stress
LOCTITE® ECCOBOND UF 9000AE
Underfill encapsulant for large die flip-chip BGA and Cu pillars
LOCTITE® ECCOBOND UF 3711
UV-curable edge bond adhesive for chips
LOCTITE® ECCOBOND E 1216M
Capillary-flow epoxy underfill for high volume operations
LOCTITE® ECCOBOND UF 3811
Halogen-free, low-viscosity reworkable underfill