Underfills

Halogen free, low viscosity, reworkable underfill 

One-part, void-free underfill for very fine area array devices

UV curable edge bond adhesive for chips

Underfill encapsulant for flip-chip BGAs and Cu pillars

One-part underfill compatible with small gap sizes

One-part, black epoxy underfill for preventing mechanical stress

One-part, halogen-free, fully RoHS-complaint epoxy underfill

One-part, capillary-flow epoxy underfill for high volume operations

One-part, halogen-free epoxy underfill for shock and drop protection

One-part epoxy underfill with excellent thermal performance

One-part, void-free, second level epoxy underfill