Skip to Content
Henkel Adhesive Technologies
Recent searches

      Henkel Adhesive Technologies

      Thermal management materials

      Filters

      $
      $
      • A packshot of BERGQUIST SIL PAD TSP 1600S showing pink sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 1600S

        Electrically insulating pad - general purpose
      • A packshot of BERGQUIST SIL PAD TSP 900 showing grey sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 900

        The original fiberglass-reinforced electrical insulator
      • This is a product packshot for BERGQUIST LIQUI FORM TLF 4500CGEL-SF

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 4500CGEL-SF

        High performance, silicone-free post-cure gel for automotive electronics  
      • A packshot of BERGQUIST LIQUI BOND TLB SA3500 showing brown and light grey 50CC, 200CC, and 400CC kits.

        Thermally conductive adhesives

        BERGQUIST® LIQUI BOND TLB SA3500

        Dispensable liquid for structural component bonding - extreme environments
      • A packshot of BERGQUIST LIQUI FORM TLF 6000HG showing a grey 600CC cartridge.

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 6000HG

        For telecom market applications requiring high gap fill
      • A packshot of BERGQUIST SIL PAD TSP 1800 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 1800

        Electrically insulating, fibreglass-reinforced - exceptional performance

      • Thermal gels

        BERGQUIST® LIQUI FORM TLF 6500CGEL-SF

        Silicone-free, post-cure gel for automotive electronics
      • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP Q2000

        Electrically conductive fibreglass-reinforced pad - withstands processing stress
      • This is a group packshot for BERGQUIST LIQUI FORM TLF 3500CGEL

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 3500CGEL

        Highly thermally conductive gel for demanding applications
      • A packshot of BERGQUIST HI FLOW THF 1500P showing gold sheets, die cuts, and die cut roll.

        Phase change materials

        BERGQUIST® HI FLOW THF 1500P

        Electrically insulating reinforced pad
      • A packshot of BERGQUIST GAP PAD TGP 2000 showing grey sheets and die cuts.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP 2000

        Thermally conductive, reinforced pad for low-stress applications 

      • Thermal gels

        BERGQUIST® LIQUI FORM TLF LF3500

        For demanding, stay-in-place applications

      Henkel Adhesive Technologies
      Company
      About us
      Locations
      Careers
      News
      Current Customer eShop
      Sustainability
      Help
      FAQs
      Find a TDS
      Find a SDS
      Find a distributor
      Contact us
      Resource center
      Product search
      Technical library
      Case studies
      White papers
      Webinars
      Brochures
      Social media
      ⓒ 2025 Henkel Corporation. ALL RIGHTS RESERVED
      You are on a United States website