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      • Packshot for black adhesive of LOCTITE ABLESTIK TE 3530 in 3cc, 5cc, 10cc, 30cc

        Thermally conductive adhesives

        LOCTITE® ABLESTIK TE 3530

        Thermally conductive epoxy adhesive for heat dissipation components
      • A packshot of BERGQUIST HI FLOW THF 1600G showing green sheets, die cuts, and die cut roll.

        Phase change materials

        BERGQUIST® HI FLOW THF 1600G

        Electrically insulating reinforced pad
      • A packshot of BERGUIST microTIM mTIM 1013 showing a heat sink with a tan microTIM film.

        Thermally conductive films

        BERGQUIST® microTIM mTIM 1013

        Durable micro-thermal interface coating for pluggable optical modules
      • This is a group packshot for BERGQUIST LIQUI FORM TLF 3500CGEL

        Thermal gels

        BERGQUIST® LIQUI FORM TLF 3500CGEL

        Highly thermally conductive gel for demanding applications
      • packshot for black gap pad material BERGQUIST GAP PAD TGP EMI 4000

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP EMI 4000

        Multifunctional gap pad for electromagnetic radiation absorption
      • A packshot of BERGQUIST GAP PAD TGP EMI1000 showing black sheets and die cuts.

        Thermal GAP PAD Materials

        BERGQUIST® GAP PAD® TGP EMI1000

        High-conformable pad combining thermal dissipation and EMI absorption
      • A packshot of LOCTITE TCP 4000 D showing a gray 300ML semco cartridge, a 610ML jar, and a 55CC EFD syringe.

        Phase change materials

        LOCTITE® TCP 4000D

        Dispensable paste - low thermal impedance
      • A packshot of LOCTITE TCP 4000 PM showing a gray 300ML semco cartridge.

        Phase change materials

        LOCTITE® TCP 4000 PM

        Printable paste - low thermal impedance
      • Packshot for blue two-component polyurethane thermally conductive adhesive in dual cartridge

        Thermally conductive adhesives

        LOCTITE® TLB 9300 APSi

        High bond strength, thermally conductive, electrically insulating adhesive
      • A packshot of BERGQUIST SIL PAD TSP 1600 showing gold sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP 1600

        Electrically insulating pad - highly compliant soft material

      • Phase change materials

        BERGQUIST® HI FLOW THF 5000UT

        Thin bond line, low pressure - for advanced devices
      • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

        Thermal SIL PAD Materials

        BERGQUIST® SIL PAD® TSP Q2000

        Electrically conductive fibreglass-reinforced pad - withstands processing stress

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