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Henkel Adhesive Technologies
Thermal gap fillers
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
BERGQUIST® GAP FILLER TGF 4000
Versatile, high performance, dispensable liquid
Thermal gels
BERGQUIST® LIQUI FORM TLF 10000
High-performance thermal interface gel for telecom market applications
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
BERGQUIST® GAP FILLER TGF 1500LVO
Versatile dispensable liquid with low outgassing
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3004SF
Soft, electrically insulating pad - silicone free
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced pad for low-stress applications
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft, electrically insulating pad with exceptional thermal conductivity
Thermally conductive adhesives
LOCTITE® TLB 9300 APSi
High bond strength, thermally conductive, electrically insulating adhesive
BERGQUIST® GAP FILLER TGF 4500CVO
Dispensable liquid with controlled outgassing
