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Henkel Adhesive Technologies
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP K1300
Electrically insulating, polyimide reinforced pad - high performance
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 1350
Reworkable, thermally-conductive gap pad for fragile components
BERGQUIST® GAP PAD TGP 3004SF
Soft, electrically insulating pad - silicone free
BERGQUIST® GAP PAD TGP 3500ULM
Soft, fiberglass reinforced electrically insulating pad
BERGQUIST® GAP PAD® TGP EMI1000
High-conformable gap pad combining thermal dissipation and EMI absorption
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced gap filler for low-stress applications
BERGQUIST® GAP PAD® TGP 3000
Soft, fiberglass reinforced insulation pad - low stress applications
BERGQUIST® SIL PAD® TSP A2000
Thermally conductive, tacky-both-sides, fiberglass-reinforced insulating material
BERGQUIST® GAP PAD® TGP HC5000
Soft, fiberglass-reinforced insulation pad - high performance
BERGQUIST® SIL PAD® TSP 1800ST
Thermally-conductive soft pad material with natural tack on both sides
