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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD TGP 10000ULM
Soft, electrically insulating pad - exceptional thermal conductivity
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill
BERGQUIST® LIQUI FORM TLF 10000
High performance, telecom market applications
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally-conductive gel for demanding applications
BERGQUIST® GAP PAD TGP 3000ULM
Soft, fiberglass reinforced electrically insulating pad
BERGQUIST® GAP PAD TGP 12000ULM
Extremely soft, electrically insulating pad - exceptional thermal conductivity
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
Phase change materials
LOCTITE® TCP 7000
Printable paste - high operating temperature
LOCTITE® TCP 4000 PM
Printable paste - low thermal impedance
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
LOCTITE® ABLESTIK TE 3530
Thermally-conductive epoxy adhesive for heat dissipation components
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap-filler for electronic assembly applications
