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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Thermal gap fillers

BERGQUIST® GAP FILLER TGF 4000

Versatile, high-performance dispensable liquid

A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2167392

BERGQUIST® GAP FILLER TGF 4000, 50 ml Dual cartridge

Documents

Information

BERGQUIST® GAP FILLER TGF 4000 is a 4.0 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). The mixed liquid system cures at room temperature or can be accelerated using heat. It offers extended working time for improved manufacturing flexibility, and the low-level natural tack characteristics are ideal for assemblies where strong structural bonds are not required. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Product category:

Thermal gap fillers

Technologies:

Cure type:

Heat cure

Flame rating:

V-0

Hardener: Color:

White

Mixed: Color:

Blue

Operating temperature:

-60.0 °C - 200.0 °C

Resin: Color:

Blue

Thermal conductivity:

4.0 W/mK

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