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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST® GAP FILLER TGF 4000

Versatile, high performance, dispensable liquid gap filler

This highly thermally-conductive liquid gap filler offers easy, precision dispensing, low stress assembly, and excellent low and high temperature, mechanical and chemical stability.

Marketing materials

Part no. (SKU/IDH):
2167392

IDH Name:
BERGQUIST® GAP FILLER TGF 4000, 50 ml Dual cartridge

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST GAP FILLER TGF 4000 is a 2-part, highly thermally conductive liquid gap filler. The mixed system will cure at room temperature, or faster with the addition of heat. It offers an extended working time to allow greater flexibility in the assembly process and, unlike cured thermal pad materials, a liquid offers infinite thickness variations with little or no stress to the sensitive components during assembly. You can also expect low level natural tack. Once cured, this product provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps.

  • Product category:
  • Thermal gap fillers

Technologies:

  • Cure type:
  • Heat cure

 

  • Flame rating:
  • V-0

 

  • Hardener: Color:
  • White

 

  • Mixed: Color:
  • Blue

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Resin: Color:
  • Blue

 

  • Thermal conductivity:
  • 4.0 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

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