Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers


Versatile, high-performance dispensable liquid

A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

BERGQUIST GAP FILLER TGF 4000, 50 ml Dual cartridge

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BERGQUIST® GAP FILLER TGF 4000 is a 4.0 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). The mixed liquid system cures at room temperature or can be accelerated using heat. It offers extended working time for improved manufacturing flexibility and the low-level natural tack characteristics are ideal for assemblies where strong structural bonds are not required.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Cure type:

Heat Cure

Flame rating:


Hardener: Color:


Mixed: Color:


Operating temperature:

-60.0 °C - 200.0 °C

Resin: Color:


Thermal conductivity:

4.0 W/mK

Please contact us for ordering options

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