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Henkel Adhesive Technologies
SONDERHOFF dosing machines
SONDERHOFF® Dosing Cell 3E PUR
Mixing and dosing machine for processing 2-part PUR systems
SONDERHOFF® Dosing Cell 3E SIL
Cellular mixing and dosing machine for processing 2-part SIL systems
SONDERHOFF® Dosing Cell 3E FLEX
Mixing and dosing machine customizable for processing 2-part PUR or SIL systems
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 1350
Reworkable, thermally conductive gap pad for fragile components
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
BERGQUIST® GAP FILLER TGF 1000SR
Thermally conductive, liquid gap-filler material
Thermally conductive adhesives
LOCTITE® TLB 9300 APSi
High bonding strength, thermally conductive, electrically-insulating adhesive
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap-filler for electronic assembly applications
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption
Thermal gels
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
LOCTITE® 384
Thermally-conductive adhesive for bonding heat-generating electronic components
BERGQUIST® GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid gap filler
