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Henkel Adhesive Technologies
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP 1800ST
Thermally conductive soft pad material with natural tack on both sides
Thermally conductive adhesives
LOCTITE® TLB 9300 APSi
High bond strength, thermally conductive, electrically insulating adhesive
BERGQUIST® GAP PAD® TGP 1350
Reworkable, thermally conductive pad for fragile components
BERGQUIST® GAP FILLER TGF 4000
Versatile, high performance, dispensable liquid
BERGQUIST® GAP FILLER TGF 4400LVO
Next generation gap filler for electronic assembly applications
BERGQUIST® GAP FILLER TGF 1450
Versatile, cost-effective dispensable liquid
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
BERGQUIST® GAP FILLER TGF 1500LVO
Versatile dispensable liquid with low outgassing
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
BERGQUIST® GAP FILLER TGF 1500
