Thermal SIL PAD Materials
Thermally-conductive soft pad material with natural tack on both sides
This fiberglass-reinforced elastomeric material has exceptional thermal performance and low compression force. Available in both sheet and roll form, it’s perfect for automated pick and place process in high volume assemblies.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® SIL PAD TSP 1800ST is a fiberglass-reinforced thermal interface material that is naturally tacky on both sides. It’s available in both sheet or roll form, allowing excellent automated pick-and-place processing in high volume assemblies. The pad material is repositionable and designed to be placed between the electronic power device and the heat sink. Ideal for use with power supplies, automotive electronics and motor controls. Exhibits superior thermal performance and low compression forces.
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Natural tack on both sides keeps position secure
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Suitable for automated pick and place processing from rolls
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Low compression force due to softness
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Excellent thermal performance
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermosets, epoxy
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Thermal management, circuits and substrates
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Thermal management, sil pads
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Thermal management, silicone pads
- Carrier type:
- Fiberglass
- Color:
- Blue
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 180.0 °C
- Standard thickness:
- 0.203 mm
