Thermal gap fillers
Self-leveling, injectable, thermally-conductive gap filler
Self-leveling, thermally conductive, silicone-based liquid gap filler for heat transfer and vibration dampening. Excellent low and high temperature stability.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 1400SL is a 2-part, silicone based, thermally-conductive liquid gap filler. Its low viscosity enables self-leveling and filling of unique and intricate gaps, resulting in excellent thermal transfer and vibration dampening. It can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It’s curable at room temperature, but you can speed up the cure by applying heat.
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Self leveling, Injectable
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Excellent low and high temperature stability
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Excellent wet-out for low stress interface applications
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Thermal conductivity: 1.4 W/m-K
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Vibration dampening
Cure type:
Heat cure
Flame rating:
V-0
Hardener: Color:
White
Mixed: Color:
Yellow
Operating temperature:
-60.0 °C - 200.0 °C
Resin: Color:
Yellow
Thermal conductivity:
1.4 W/mK