Thermal gap fillers
Self-leveling, injectable, thermally conductive liquid
This self-leveling, thermally conductive, silicone-based liquid gap filler is designed for heat transfer and vibration dampening. It has excellent low and high temperature stability.
Marketing materials
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 1400SL is a 2-part, silicone based, thermally conductive liquid gap filler. Its low viscosity enables self-leveling and filling of unique and intricate gaps, resulting in excellent thermal transfer and vibration dampening. It can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It’s curable at room temperature, but you can speed up the cure by applying heat.
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Self leveling, injectable
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Excellent low and high temperature stability
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Excellent wet-out for low stress interface applications
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Thermal conductivity: 1.4 W/m-K
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Vibration dampening
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, low viscosity liquids
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Thermal management, silicone liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Mixed: Color:
- Yellow
- Operating temperature:
- -60.0 °C - 200.0 °C
- Resin: Color:
- Yellow
- Thermal conductivity:
- 1.4 W/mK
