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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST® GAP FILLER TGF 1400SL

Self-leveling, injectable, thermally-conductive gap filler

Self-leveling, thermally conductive, silicone-based liquid gap filler for heat transfer and vibration dampening. Excellent low and high temperature stability.

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Information

BERGQUIST® GAP FILLER TGF 1400SL is a 2-part, silicone based, thermally-conductive liquid gap filler. Its low viscosity enables self-leveling and filling of unique and intricate gaps, resulting in excellent thermal transfer and vibration dampening. It can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It’s curable at room temperature, but you can speed up the cure by applying heat.

  • Product category:
  • Thermal gap fillers

Technologies:

  • Cure type:
  • Heat cure

 

  • Flame rating:
  • V-0

 

  • Hardener: Color:
  • White

 

  • Mixed: Color:
  • Yellow

 

  • Operating temperature:
  • -60.0 °C - 200.0 °C

 

  • Resin: Color:
  • Yellow

 

  • Thermal conductivity:
  • 1.4 W/mK

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

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