Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gels

Combine greater thermal conductivity and highly conformable gap-filling capabilities to improve your product performance and reliability with thermal gels.
Visual showing Thermal Gel applied on top of a gray electronic chip.
Liqui Form Thermal Gel Precision Dot Dispensing on Printed Circuit Board.

Find thermal gel products

Find Bergquist® thermal gels suitable for a wide range of industrial, automotive, and other applications. Explore the range to discover solutions for telecom infrastructure, systems, ADAS components, and more.

Combine greater thermal conductivity and highly conformable gap-filling capabilities

Thermal gels are one component products, available as cure-in-place or pre-cure solutions. Thermal gel materials can be reworkable after application and their flow characteristics can be customized for various application requirements. These thermal products are suitable for automation and mass production. For more details on the qualities and benefits of thermal gels, please watch the video. 
A series of different electronic components on top of a circuit board with thermal gel applied.

What are thermal gels?

Thermally conductive gels, available in one-component liquid formable and curable formulations, are thermal interface materials designed to provide low component stress, rework simplicity, process flexibility, in-application stability, and efficient thermal conductivity.

Liquid thermal management materials, gels are designed to help you effectively manage heat in electronic applications, improving device performance and overall reliability. Their liquid form means they are highly conformable, so can be utilized across many different types of assembly.

These heat dissipation gels are effective across industrial and automotive applications, among others.

Why use Henkel thermal gels?

Highly conformable gap-filling means Henkel heat dissipation gel delivers better thermal conductivity during your electronic product assembly than many alternative products.

Henkel thermal management gels are unique in their performance as heat-dissipating materials. Once dispensed, they hold their shape to avoid flowing into areas where they are not needed, so they can fill highly intricate shapes for diverse and varied topographies. They can also be used in a wide range of applications, so you get one solution for many applications.

A close up of an optical transceiver circuit board with thermal gel material applied.
3D graphic of LIQUI-FORM in close-up

Thermal gels minimize gaps and voids while maximizing thermal performance. This makes them ideal for applications where high gap stability is required, such as in telecom infrastructure systems and automotive ADAS components. As liquid materials, thermal gels minimize stress on assemblies for more intricate and delicate components.

They’re easy to use too. Supplied as one-part materials, pre-cured or cure-in-place, Bergquist® brand LIQUI FORM thermal gels require no mixing. They also cure in place with flexible curing protocols, are available in silicone and silicone-free formulations, and are well-suited to high volume production.

Why choose thermal gels?

Automation

...
Automation and mass production capabilities.

Reliability

...
Long-term reliability with in-application stability.

Effective heat control

...
Effective heat control with good gap-filling capability and high thermal conductivity.

Low component stress

...
Low component stress during assembly to eliminate the risk of damage to components.
Thermal gel products being applied to a circuit board

Choosing a thermal gel

LOCTITE® Bergquist® thermal gels can be used across many electronic applications and industries. Explore all our thermal gels and find the one that is right for your application.

An automated robot applying thermal gel to a chip set in an industrial setting.

Industrial applications

Bergquist® LIQUI FORM thermal interface gels are high thermal conductivity liquid formable materials that can be automatically dispensed, provide low component stresses during assembly and simplify rework processes.

These highly conformable, shear-thinning materials require no curing, no mixing or refrigeration, streamlining storage, handling, and processing. The unique chemistry platform delivers excellent thermal performance, low applied stress, and reliable long-term performance.

Thixotropic with a natural tack, Bergquist® LIQUI FORM materials conform to the component and remain in place within the application.

An automotive electronic componet with several applications of thermal gel.

Automotive applications

Designed for demanding, high-reliability environments, Bergquist® LIQUI FORM CGels provide form-in-place functionality via moisture or thermal cure. Upon cure, the one-part thermal gels provide a soft, thermally conductive material capable of reducing air voids and gaps.

Bergquist® CGels have been uniquely designed to deliver highly reliable vertical gap stability even in an uncured state. With no mixing required and good dispensing efficiency, Bergquist® LIQUI FORM CGels enable high throughput mass production while assuring reliability due to their cure-in-place final modulus.

These Henkel thermal gels have passed severe hazing and fogging testing, making them exceptionally well-suited for optical systems such as ADAS cameras and lidars.

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