Enhance thermal conductivity and reduce troublesome air gaps between electrical components with thermal gap fillers; low stress, high volume capable TIMs.
Free-flowing liquid gap fillers self-level and fill intricate air voids, which means they can be used across a wide range of different gaps, components, and devices. Their thixotropic qualities mean they hold their shape when dispensed. Find a solution for every task with the range of Bergquist® thermal gap fillers. Explore the full range:
Thermal gap fillers are two component products that are cure-in-place. They provide conformability to intricate topographies with the highest reliability and reduce stress on components. This thermal solution can also be used for automated processes and offers flexibility, becoming a single solution for many applications. For more details on the qualities and benefits of thermal gap fillers, please watch the video.
Gap fillers are thermally conductive gap filling liquid materials designed to enhance thermal performance and enable easier dispensing application for your high-volume manufacturing operations.
These materials provide unrivaled thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, helping you improve performance and reliability across your device assemblies.
Because they’re liquid mediums, thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces. This allows them to deliver better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums.
Application volume and pattern are completely adaptable to suit a wide range of applications.
Henkel gap fillers are designed with an understanding of the intricacies of balancing filler content with thermal conductivity requirements and product integrity. Our optimized liquid gap filling materials can be deposited in extremely high volume for industries like automotive, where large systems require maximum heat dissipation.
Henkel has established strategic equipment partnerships with the world’s leading automated dispensing equipment companies. This means we can customize our gap-filling solutions for your dynamic applications and enable the various dispensing technologies you require.
Bergquist® gap fillers are supplied as two-component, room or elevated temperature curing systems. They result in a soft, thermally conductive, form-in-place elastomer, ideal for coupling heat-producing devices with an adjacent metal case or heat sink.
Thermally conductive gap fillers are primarily for applications where stronger structural bonds are not required. For applications where structural bonding is a consideration, check out our range of thermal conductive adhesives.
For manufacturing operations where a one-part material is preferred over a two-part material that requires mixing, thermal gels offer an alternative to liquid gap fillers.
Heat dissipating liquid gap fillers are frequently utilized in markets such as automotive, where high reliability is required. Gap fillers also offer the added benefit of being able to withstand extremely harsh environments after curing. Thermal gels are most often used for stationary applications, such as those found within the telecoms sector.
Ultra-low modules for minimal stress during assembly
Because gap fillers are dispensed and wet-out in a liquid state, the materials will create virtually zero stress on components during the assembly process. Thermal gap fillers can be used to interface even the most fragile and delicate devices.
Excellent conformability to intricate geometries
Liquid gap filler materials can conform to intricate topographies, including multi-level surfaces. Due to their flowability before cure, gap fillers can fill small air voids, crevices, and holes. This reduces the overall thermal resistance to the heat-generating device.
Single solution for multiple applications
Unlike pre-formed gap filling materials, liquid gap fillers offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications.
Efficient material usage
Manual or semi-automatic dispensing tools can be used to apply liquid thermal gap filling materials directly to the target surface, resulting in efficient use of material with minimal waste. Further material volume optimization can be achieved with the implementation of automated dispensing equipment, which allows for precise material placement and reduces the material application time.
Customizable flow characteristics
Although thermal gap fillers are designed to flow easily with minimal pressure, they are thixotropic, which helps the material remain in place after dispensing and before cure. Bergquist® gap filler offerings include a range of rheological characteristics and can be tailored to meet your flow requirements. This includes self-leveling and highly thixotropic materials that maintain their form as dispensed.
LOCTITE® Bergquist® liquid gap fillers can be used across many electronic applications and industries. Explore all our liquid gap fillers and find the one that is right for your application.
Gap fillers are used in many applications, thanks to their diversity and flexible dispensation. In the modern world of electronics, gap fillers can be used in many electronic components, including:
- Printed circuit boards (PCBs)
- Power supply cooling
- High volume applications where automatic dispensing can be used
- Where pad configurations are not suitable
- Where potting compounds can be used
- Across varied topographies and surfaces
- In gaps higher than 0.5mm, to eliminate voids
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