Thermal gap fillers
Versatile, cost-effective dispensable liquid
A thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
Size Please make your selection 400 ml
Packaging type Please make your selection Dual cartridge
- Technical specification
BERGQUIST® GAP FILLER TGF 1450 is a 1.4 W/m-K thermally conductive, ultra-conforming silicone-based liquid gap filler (2-part). It provides a high level of control due to its high shear thinning characteristics and dries with a low density to reduce final assembly weight. The mixed system remains ultra-conforming with excellent wet-out for near zero interface stress and offers infinite thickness variations without adding stress to the sensitive components during or following assembly. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Dielectric constant, ASTM D150, @ 1kHz:
Heat capacity, ASTM E1269:
Mix ratio, by volume:
1 : 1
Mix ratio, by weight:
1 : 1
Pot life, @ 25.0 °C:
Shore hardness, Thirty second delay value, ASTM D2240, Shore 00:
1×10 Ohm m