Thermal gap fillers
Versatile, cost-effective dispensable liquid
A thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 1450 is a 1.4 W/m-K thermally conductive, ultra-conforming silicone-based liquid gap filler (2-part). It provides a high level of control due to its high shear thinning characteristics, and dries with a low density to reduce final assembly weight. The mixed system remains ultra-conforming with excellent wet-out for near zero interface stress, and offers infinite thickness variations without adding stress to the sensitive components during or following assembly. This product is curable at room temperature, and the cure rate can be accelerated by applying heat.
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Thermal conductivity: 1.5 W/m-K
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Excellent low and high thermal, mechanical and chemical stability
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Ultra-conforming with excellent wet-out for near zero interface stress
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Easy to use due to its shear thinning viscosity
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Low density for weight sensitive application
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
- Density:
- 1.85 g/cm³
- Dielectric constant, ASTM D150, @ 1kHz:
- 6.4
- Flame rating:
- V-0
- Hardener: Color:
- Light blue
- Heat capacity, ASTM E1269:
- 1.0 J/g-K
- Mix ratio, by volume:
- 1 : 1
- Mix ratio, by weight:
- 1 : 1
- Pot life, @ 25.0 °C:
- 60.0 min.
- Resin: Color:
- Blue
- Shelf life:
- 6.0 mon.
- Shore hardness, Thirty second delay value, ASTM D2240, Shore 00:
- 40.0
- Storage temperature:
- 25.0 °C
- Thermal conductivity:
- 1.5 W/mK
- Volume resistivity:
- 1×10 Ohm m
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