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      Part no. (SKU/IDH):
      2554652

      IDH Name:
      BERGQUIST® GAP FILLER TGF 1450, 400 ml Dual cartridge

      Thermal gap fillers

      BERGQUIST® GAP FILLER TGF 1450

      Versatile, cost-effective dispensable liquid

      This thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly.

      Technical (1)

      RoHS (2)

      Regulatory (2)

      Part no. (SKU/IDH):
      2554652

      IDH Name:
      BERGQUIST® GAP FILLER TGF 1450, 400 ml Dual cartridge

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

      Information

      BERGQUIST® GAP FILLER TGF 1450 is a 1.4 W/m-K thermally conductive, ultra-conforming silicone-based liquid gap filler (2-part). It provides a high level of control due to its high shear thinning characteristics, and dries with a low density to reduce final assembly weight. The mixed system remains ultra-conforming with excellent wet-out for near zero interface stress, and offers infinite thickness variations without adding stress to the sensitive components during or following assembly. This product is curable at room temperature, and the cure rate can be accelerated by applying heat.
      • Thermal conductivity: 1.5 W/m-K
      • Excellent low and high thermal, mechanical and chemical stability
      • Ultra-conforming with excellent wet-out for near zero interface stress
      • Easy to use due to its shear thinning viscosity
      • Low density for weight sensitive application
      • Product category:
      • Thermal gap fillers

      Technologies:

      • Thermal management, standard viscosity liquids
      • Density:
      • 1.85 g/cm³

       

      • Dielectric constant, ASTM D150, @ 1kHz:
      • 6.4

       

      • Flame rating:
      • V-0

       

      • Hardener: Color:
      • Light blue

       

      • Heat capacity, ASTM E1269:
      • 1.0 J/g-K

       

      • Mix ratio, by volume:
      • 1 : 1

       

      • Mix ratio, by weight:
      • 1 : 1

       

      • Pot life, @ 25.0 °C:
      • 60.0 min.

       

      • Resin: Color:
      • Blue

       

      • Shelf life:
      • 6.0 mon.

       

      • Shore hardness, Thirty second delay value, ASTM D2240, Shore 00:
      • 40.0

       

      • Storage temperature:
      • 25.0 °C

       

      • Thermal conductivity:
      • 1.5 W/mK

       

      • Volume resistivity:
      • 1×10 Ohm m

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                              Video of gap filler being applied onto different components on a board and glas being pressed onto the gap filler afterwards

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                              Video giving an overview to the product Thermal Gap Filler

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