Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST GAP FILLER TGF 1000SR

Thermally conductive, liquid gap-filler material 

Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications

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Documents

Information

BERGQUIST® GAP FILLER TGF 1000SR is a 2-part silicone based thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It has excellent low and high temperature mechanical and chemical stability, and is intended for use in automotive electronics applications. 

Cure type:

Heat Cure

Flame rating:

V-0

Hardener: Color:

White

Operating temperature:

-60.0 °C - 175.0 °C

Thermal conductivity:

0.1 W/mK

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