Part no. (SKU/IDH):
2167100
IDH Name:
BERGQUIST® GAP FILLER TGF 1000SR
Thermal gap fillers
Thermally conductive dispensable liquid
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It's ideal for use in automotive electronics applications.
Marketing materials
Part no. (SKU/IDH):
2167100
IDH Name:
BERGQUIST® GAP FILLER TGF 1000SR
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally conductive liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature or faster with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It has excellent low- and high-temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
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Excellent slump resistance
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Excellent low and high temperature stability
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Ultra-conforming
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Excellent wet-out for low stress interface applications
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Thermal conductivity: 1.0 W/m-K
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal gap fillers
Technologies:
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Standard viscosity liquids
- Cure type:
- Heat cure
- Flame rating:
- V-0
- Hardener: Color:
- White
- Operating temperature:
- -60.0 °C - 175.0 °C
- Thermal conductivity:
- 0.1 W/mK
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Large volume or special order?
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