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Henkel Adhesive Technologies
Thermal gels
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 1400SL
Self-leveling, injectable, thermally conductive liquid
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
BERGQUIST® GAP FILLER TGF 1000SR
Thermally conductive dispensable liquid
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP A2000
Thermally conductive, tacky, fiberglass-reinforced insulating material
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3000
Soft, fiberglass-reinforced insulation pad - low stress applications
BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
High performance, silicone-free post-cure gel for automotive electronics
BERGQUIST® GAP PAD® TGP EMI 4000
Multifunctional gap pad for electromagnetic radiation absorption
BERGQUIST® GAP PAD® TGP 2000
Thermally conductive, reinforced pad for low-stress applications
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
BERGQUIST® SIL PAD® TSP 1800
Electrically insulating, fibreglass-reinforced - exceptional performance
Thermally conductive adhesives
BERGQUIST® LIQUI BOND TLB SA2000
Dispensable liquid adhesive for structural component bonding
