Thermal gap fillers
Next generation gap filler for electronic assembly applications
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler is designed for control units and ADAS components, and offers highly reliable thermal management and robust processing.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 4400LVO is a silicone, 2-part, room temperature curable gap filler, ideal for a wide range of electronic assembly applications. With 4.4 W/(m.K) thermal conductivity and the possibility to achieve thin bondlines, it provides an excellent and versatile solution for optimizing heat dissipation in demanding applications. Its superior mechanical stability offers reliability and consistency in harsh operating conditions over the entire lifetime of electronics components. Perfect for use in automotive, industrial and consumer applications.
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Low volatile silicone technology
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>90-minutes pot life and 12-hour RT cure
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Fast, robust dispensing properties
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Can provide a thin bondline
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, standard viscosity liquids
- Key characteristics:
- Conductivity: thermally conductive
- Number of components:
- 2 part
- Physical form:
- Liquid
