Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal gap fillers

BERGQUIST GAP FILLER TGF 4400LVO

Next generation gap-filler for electronic assembly applications 

This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler for control units and ADAS components offers highly reliable thermal management and robust processing. 

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Documents

Information

BERGQUIST® GAP FILLER TGF 4400LVO is a silicone, 2-part, room-temperature curable gap filler, ideal for a wide range of electronic assembly applications. With 4.4 W/(m.K) thermal conductivity and the possibility to achieve thin bondlines, it provides an excellent and versatile solution to optimize heat dissipation in demanding applications. Its superior mechanical stability offers reliability and consistency over harsh operating conditions over the entire lifetime of electronics components. Perfect for use in automotive, industrial, and consumer applications. 

Key characteristics:

Conductivity: Thermally Conductive

Number of components:

2 Part

Physical form:

Liquid

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