Thermal gap fillers
Next generation gap-filler for electronic assembly applications
This next generation, 2-part, low volatile outgassing (LVO) silicone-based gap filler for control units and ADAS components offers highly reliable thermal management and robust processing.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP FILLER TGF 4400LVO is a silicone, 2-part, room-temperature curable gap filler, ideal for a wide range of electronic assembly applications. With 4.4 W/(m.K) thermal conductivity and the possibility to achieve thin bondlines, it provides an excellent and versatile solution for optimizing heat dissipation in demanding applications. Its superior mechanical stability offers reliability and consistency in harsh operating conditions over the entire lifetime of electronics components. Perfect for use in automotive, industrial, and consumer applications.
-
Low volatile silicone technology
-
>90mins working time & 12hr RT cure
-
Fast, robust dispensing properties
-
Can provide a thin bondline
Product category:
Thermal gap fillers
Technologies:
-
Thermal management, standard viscosity liquids
Key characteristics:
Conductivity: thermally conductive
Number of components:
2 part
Physical form:
Liquid
