Henkel Adhesive Technologies

Henkel Adhesive Technologies

Data center

Data center speed and volume are skyrocketing as analytics, high-performance computing, and artificial intelligence go mainstream. Inside hyperscale data centers, powerful components must deliver high-speed processing and faster data access with smaller, denser, hotter components that do more with less. Component-level thermal management and stress protection are required to meet these heightening performance needs.

This is an image showing a futuristic data center.

At a glance

20%

Cost increase each year

...
Yet budgets are only rising 6% per year.1

300 MW

Heat

...
generated from a data center campus can power a midsize city.2

40%

of data center’s energy consumption

...
is spent on powering cooling and ventilation systems.3

Explore our other Data and telecommunication solutions

  • Broadband connectivity

  • Optical

Data center solutions

Next-generation data centers are getting hotter. They must provide faster speeds and rapid data access with smaller, higher-density components as data volumes skyrocket. Heat degrades performance. Advanced materials help with thermal management, long-term reliability, and stress protection.

an engineer in a server room inspecting a mainframe computer

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Resources

  • An image of an ice block over a printed circuit board

    The heat is on

    Today, network performance, reliability, and durability are critical to datacom and telecom performance around the world. And when network performance is largely determined by power and cooling, the role of thermal management is only going to increase.
    ...
  • This is an image of a network cable with fiber optical background

    The 2023 data center pulse report

    With an insatiable demand for faster networking speeds and throughput performance within the data center, 800 Gigabit Ethernet (GbE) is gaining momentum as the next big trend in networking to provide capacity to ever-growing customer demands.
    ...
  • This is an image of a futuristic circuit board like a city at night

    Look small to go big

    In today’s world of unprecedented network and infrastructure expansion, the need for increased performance and stability is accelerating. This rapid expansion is further challenged by the need to process more data at faster speeds while also accommodating emerging technology developments.
    ...

Applications

Rendered graphic of a line card with multiple heatsinks inserted over a transparent background.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Routers/Switches

The use of advanced materials in server motherboards and line cards for routers and switches provides a huge upside in scale, performance, and cost reduction. One small uptick in performance, repeated thousands of times, has a huge impact on router and switch performance.

3D image of a server rack
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Servers

Whether it’s a few servers in a closet or 10,000 in a data center, a small reduction in heat or uptick in component performance can have a huge, aggregate impact on infrastructure performance. Advanced materials can be used throughout a circuit board to help optimize their performance and the network that uses them.

3D image of a server rack
Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase change materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Storage

Advanced materials used in storage hardware increased stability, reliability, and transfer rates. Every uptick in performance and reliability reduces costs while delivering on increasing user expectations.

Related data center products

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Get in touch with our experts and start exploring advanced materials solutions today.

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