Data center speed and volume are skyrocketing as analytics, high-performance computing, and artificial intelligence go mainstream. Inside hyperscale data centers, powerful components must deliver high-speed processing and faster data access with smaller, denser, hotter components that do more with less. Component-level thermal management and stress protection are required to meet these heightening performance needs.
Next-generation data centers are getting hotter. They must provide faster speeds and rapid data access with smaller, higher-density components as data volumes skyrocket. Heat degrades performance. Advanced materials help with thermal management, long-term reliability, and stress protection.
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- Brochure
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- Routers/Switches
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Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 10.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.
The use of advanced materials in server motherboards and line cards for routers and switches provides a huge upside in scale, performance, and cost reduction. One small uptick in performance, repeated thousands of times, has a huge impact on router and switch performance.
Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.
Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.
One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 10.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.
Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.