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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically conductive adhesives


High performance adhesive with superior thermal and electrical conductivity

This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

LOCTITE® ABLESTIK ABP 8068TB, 5 ml Syringe



If you need a superior semi-sintering die attach adhesive for high end power packages, choose LOCTITE® ABLESTIK ABP 8068TB. It provides high adhesion, low stress, and enhanced resin bleed control. Thermal performance is comparable to that of a solder paste product, and you can expect great sintering properties on gold, silver, copper, and PPF substrates.

Coefficient of thermal expansion (CTE):

25.0 ppm/°C

Cure type:

Heat cure

Thixotropic index:


Viscosity, Brookfield CP51, @ 25.0 °C:

11500.0 mPa·s (cP)

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