Electromagnetic interference (EMI) shielding has traditionally been managed at the PCB level, using enclosures around components to mitigate interference. But cans and cages are no longer sufficient. Today’s small, thin SiPs, MCMs, and heterogeneously integrated packages require a shielding layer in or directly on the component. Package-level EMI makes reliable RF device miniaturization and high-density integration possible.
Package-level EMI shielding is a technique that isolates chips – either integrated within the same package or placed in close proximity to each other – operating at different frequencies from unwanted crosstalk that can cause electrical performance degradation or device failure. Conductive coating inks or conductive compartmental pastes are applied either on or in the package to prevent EMI-related performance challenges.
EMI shielding materials at the package level have become a necessity as packages have become thinner, smaller, and denser. Spray-on EMI metal coatings offer a streamlined alternative to cumbersome cans and cages, enabling ultra-thin interference protection from neighboring components. To effectively block multi-chip crosstalk within packages, channels are cut between chips and filled with conductive EMI paste to provide chip segregation and raise reliability.
Excellent EMI shielding performance for both conformal coating and trench filling
Proven EMI performance in multiple applications
Flexible, cost-effective alternative to vapor phase deposition (VPD)
Thin (< 5 µm), uniform coverage of package sides and tops
Good filling and adhesion performance for narrow trenches
Enables various package designs and chip/component layouts within packages
Selecting an effective package-level EMI shielding material depends on many factors, including the application requirements, electrical conductivity, frequency range compatibility, thickness and uniformity capability, adhesion, and substrate and chemical compatibility. Consultation with a Henkel materials specialist can help determine the most effective EMI shielding material solution.
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