For chip-scale package ICs that require precise bondlines, die tilt control, minimal fillets, and wirebond pads free of contamination, printable B-stage die attach adhesives offer a cost-effective alternative to traditional die attach films.
Printable B-stage die attach adhesives are paste materials that are screen- or stencil-printed onto semiconductor wafers. After printing, the adhesives are partially cured—or B-staged—to form a film-like coating on the wafer. Next, the wafer is diced into individual dies. During package assembly, heat and pressure are applied, causing the die attach material to flow and bond the die to the substrate.
Typically, printable B-stage die attach materials are used in wirebond packages where tight geometry control and process efficiency are required. These may include wirebond stacked die packages where bond wires must be free of contamination, MCMs and SiPs with challenging die spacing that dictate die attach material containment, and large die power ICs that require voiding control and good thermal resistance.
Low warpage
Modulus and CTE are optimized to help control warpage and stress
High throughput
Enables excellent throughput by printing material across the entire wafer in a mass-imaging process, rather than serial dispensing
Low bleed
Dimensionally stable after printing and B-staging (partially curing) to prevent bleed onto pads or other structures
Among others, thermal conductivity, viscosity, cure time and cure shrinkage, modulus, CTE, voiding performance, and adhesion strength are primary considerations in the selection of a B-stage die attach adhesive. Each application is unique, and consultation with a Henkel specialist can help determine the most appropriate material to achieve the desired process and performance objectives.
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