The bonding of package lids and peripheral stiffeners to substrates is a technique used across applications, including high-performance computing, AI, automotive, 5G/telecom, memory and storage, and consumer electronics. Lid and stiffener attach adhesives bolster advanced semiconductor device reliability and performance, providing stability, protection from warpage, grounding or shielding capability, and thermal control for complex packages.
Lid and stiffener attach adhesives are specialized, reliability-enhancing materials used to bond lids (heat spreaders) and structural reinforcing stiffeners to package substrates. Available in conductive and non-conductive formulations, these adhesives help maintain package and die coplanarity, reduce warpage, and, in some cases, provide electrical grounding or shielding capability during reliability testing and in operation.
Lid and stiffener attach adhesives serve many functions, including enabling efficient heat transfer from the die to the lid, providing mechanical stability to prevent warpage, delivering electrical grounding and EMI shielding capability (conductive adhesives), and offering electrical isolation (non-conductive adhesives). The materials are vital to ensuring reliable, long-term device performance in many applications.
Stress management and package coplanarity
Customized modulus and excellent elongation properties maintain package coplanarity, managing the mechanical stress of large, complex package architectures.
Good processability
The cure kinetics and spacer technology of Henkel lid and stiffener attach adhesives enable good bond line thickness control under a snap cure process.
High reliability
Henkel lid and stiffener attach adhesives maintain toughness and adhesion even after MSL testing, delivering high reliability.
To select an appropriate adhesive, consultation with a Henkel technical specialist is recommended. Our experts can help assess application requirements and align them with the required material attributes, including thermal and mechanical properties, processing characteristics, chemical compatibility, electrical properties, and reliability.
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