LOCTITE® ABLESTIK ICP 3920 | Henkel Adhesives
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Part no. (SKU/IDH):
2622102

IDH Name:
LOCTITE® ABLESTIK ICP 3920, Syringe

Electrically conductive adhesives

LOCTITE® ABLESTIK ICP 3920

Electrically conductive adhesive for SMD interconnections

A 1-part, low-temperature curing, electrically conductive die-attach adhesive designed for SMD interconnect formation and stencil/screen printing.

Part no. (SKU/IDH):
2622102

IDH Name:
LOCTITE® ABLESTIK ICP 3920, Syringe

WARNING!

Cancer and Reproductive Harm -
www.P65Warnings.ca.gov.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ABLESTIK ICP 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. It’s formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure. LOCTITE ABLESTIK ICP 3920 is an improved version of ABLESTIK CE 3920 and can be used with finer dispensing needles without clogging.

  • Product category:
  • Electrically conductive adhesives
  • Application method:
  • Dispense gun

 

  • Cure schedule, @ 110.0 °C:
  • 60.0 min

 

  • Cure type:
  • Heat cure

 

  • Number of components:
  • 2 part

 

  • Operating temperature:
  • -45.0 °C - 150.0 °C

 

  • Shear strength:
  • 1310.0 psi

 

  • Storage temperature:
  • 0.0 °C - 8.0 °C

 

  • Thixotropic index:
  • 5.7

 

  • Viscosity, cone & plate, Angle 3°, Speed 5 rpm:
  • 26100.0 mPa·s (cP)

 

  • Volume resistivity:
  • 0.0003 Ohm cm

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                • Product category:
                                • Electrically conductive adhesives

                                Technologies:

                                • Application method:
                                • Dispense gun
                                • Cure schedule, @ 110.0 °C:
                                • 60.0 min
                                • Cure type:
                                • Heat cure
                                • Number of components:
                                • 2 part
                                • Operating temperature:
                                • -45.0 °C - 150.0 °C
                                • Shear strength:
                                • 1310.0 psi
                                • Storage temperature:
                                • 0.0 °C - 8.0 °C
                                • Thixotropic index:
                                • 5.7
                                • Viscosity, cone & plate, Angle 3°, Speed 5 rpm:
                                • 26100.0 mPa·s (cP)
                                • Volume resistivity:
                                • 0.0003 Ohm cm

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