Semiconductor packages are more complex than ever, integrating thinner, higher-functioning, higher-density chips. Liquid compression molding materials, which enable wafer-level packaging, panel-level packaging, and molded underfill applications, are vital to this advancement, enabling cost-efficient, high-reliability packaging by shielding delicate ICs from damage during processing and in operation.
Liquid compression molding materials are encapsulants that enable advanced semiconductor packaging techniques where integrated circuits (ICs) are molded on a wafer or panel prior to subsequent processing. Encapsulation of ICs at the wafer-level or panel-level, along with gap filling and overmolding of stacked memory chips, is a key enabler of advanced package designs, including fan-in and fan-out wafer-level, panel-level packaging, and high bandwidth memory.
Wafer-level and panel-level encapsulation enables mass processing of ICs at scale and reduces the risk of process-related damage and contamination, increasing package reliability during manufacturing and in application. The selection of high-performance liquid compression molding materials that minimize warpage, enable fine feature gap filling, and cure quickly is important to ensuring high yields for ICs used in applications ranging from mobile and consumer devices to AI and high-performance computing.
Anhydride-free chemistry
Formulated for environmental protection and REACH compliance
Ultra-low warpage
Minimal (< 1.0 mm) wafer warpage after cure
Fine filler technology
Void-free, fast-flow, fine-filling technology ensures thorough coverage, improved protection, and higher reliability
Liquid compression molding material selection requires consideration of several criteria, including mechanical and thermal properties, coefficient of thermal expansion, flowability, cure speeds, shelf life, environmental compliance, and more. Henkel semiconductor specialists offer deep expertise and can provide application-specific molding material recommendations.
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