Electrically conductive adhesives
Semi-flexible, electrically conductive adhesive for high temperature applications
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
1368300
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- Description
- Technical specification
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
Applications:
Die attach
Coefficient of thermal expansion (CTE):
62.0 ppm/°C
Cure type:
Heat cure
Extractable ionic content, Chloride (CI-):
9.0 ppm
Extractable ionic content, Fluoride (F-):
9.0 ppm
Extractable ionic content, Potassium (K+):
9.0 ppm
Extractable ionic content, Sodium (Na+):
9.0 ppm
Hot die shear strength:
3.75 kg-f
RT die shear strength:
20.0 kg-f
Tensile modulus, @ 250.0 °C:
738.0 N/mm² (107037.0 psi)
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