Electrically conductive adhesives
Semi-flexible, electrically conductive adhesive for high temperature applications
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
1368300
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 62.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Fluoride (F-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Hot die shear strength:
- 3.75 kg-f
- RT die shear strength:
- 20.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 738.0 N/mm² (107037.0 psi)
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Large volume or special order?
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