Part no. (SKU/IDH):
500404
IDH Name:
LOCTITE® ABLESTIK QMI519, 5 cc Syringe
${product.sortedProductCategories1}
Electrically conductive die-attach adhesive for high-reliability package applications
A 1-part, BMI acrylate-based, conductive die-attach adhesive designed for bonding integrated circuits and components to metal substrates.
Marketing materials
Part no. (SKU/IDH):
500404
IDH Name:
LOCTITE® ABLESTIK QMI519, 5 cc Syringe
Size Please make your selection 5 cc
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Question & answer
LOCTITE® ABLESTIK QMI519 is a silver, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It’s typically used for QFN, SOIC and SO package applications and is compatible with a wide variety of metals and ceramic surfaces, copper, silver, palladium and alloy 42. It’s designed to achieve higher UPHs than conventional oven cured adhesives. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater. Studies have also shown that parts cured on the die bonder have improved coplanarity. LOCTITE ABLESTIK QMI519 is formulated with a BMI acrylate-based resin and cures when exposed to heat.
-
Offers a void-free bond line
-
Hydrophobic
-
Strong resistance to delamination
-
Stable at high temperatures
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 40.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 20.0 ppm
- Extractable ionic content, Fluoride (F-):
- 20.0 ppm
- Extractable ionic content, Potassium (K+):
- 20.0 ppm
- Extractable ionic content, Sodium (Na+):
- 20.0 ppm
- RT die shear strength:
- 59.0 kg-f
- Young's modulus, @ 25.0 °C:
- 5300.0 N/mm² (769000.0 psi)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Every question, request, and challenge is an opportunity for us to help your business perform. And we have all the right people ready to make it happen.
Check our FAQ for quick answers or reach out via phone to our support center. Here, we also offer additional inquiry forms to help you connect with the appropriate Henkel expert.