Die attach adhesives
Conductive die-attach adhesive for high-reliability package applications
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK QMI519 is a silver, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It’s typically used for QFN, SOIC and SO package applications and is compatible with a wide variety of metals and ceramic surfaces, copper, silver, palladium and alloy 42. It’s designed to achieve higher UPHs than conventional oven cured adhesives. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater. Studies have also shown that parts cured on the die bonder have improved coplanarity. LOCTITE ABLESTIK QMI519 is formulated with a BMI acrylate-based resin and cures when exposed to heat.
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Offers a void-free bond line
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Hydrophobic
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Strong resistance to delamination
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Stable at high temperatures
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 40.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 20.0 ppm
- Extractable ionic content, Fluoride (F-):
- 20.0 ppm
- Extractable ionic content, Potassium (K+):
- 20.0 ppm
- Extractable ionic content, Sodium (Na+):
- 20.0 ppm
- RT die shear strength:
- 59.0 kg-f
- Young's modulus, @ 25.0 °C:
- 5300.0 N/mm² (769000.0 psi)
