Harmonized automotive function is powered by semiconductor technology. From autonomous driving and electrification to advanced safety features, sophisticated semiconductor packages enabled by high-performance materials deliver a reliable, safe, and comfortable driving experience.
>7% Sensor CAGR
through 2029
The automotive sector is set to experience healthy growth in sensor technology over the next three years1.
$13 Billion
through 2030
Automotive MCU revenue is projected to expand significantly through 2030, fueled by ADAS, EVs, and software-defined vehicle advances2.
$10 Billion
WBG Market
By 2030, SiC and GaN semiconductor devices will nearly double their share of the global power devices market – growing from 16% today to 32% by the end of the decade. Much of this expansion will be driven by the automotive sector3.
Semiconductor technology defines today’s automotive capabilities, spanning vehicle power systems, sensing devices, and processors. Henkel has advanced materials to support the functionality and reliability of these diverse applications, helping to deliver a safe, responsive, and connected driver experience.
- Sensors
- Processors
- Power devices
Die attach pastes and films provide robust support for large devices requiring extremely low warpage and excellent substrate adhesion for very high reliability in mission-critical ADAS systems.
Low-stress encapsulants are ideal for delicate iBGA image sensor and ceramic cavity packaging, with CTE and modulus optimized for high reliability performance.
Image sensors are the vehicle’s eyes, delivering crucial data to cameras for ADAS and computer vision systems. Combined with RADAR and LIDAR sensors, these technologies also enable autonomous vehicle control. Semiconductor technology determines the reliability and capabilities of these devices, which depend on wafer-level packaging, high-performance die attach adhesives, and encapsulation materials to meet demanding functionality requirements.
Proprietary hybrid resin/filler system ensures die attach pastes with low modulus and good stress management for high-density bare Cu and Ag/PPF leadframes.
Conductive die attach films are optimized for standard and exposed pad QFPs/TSSOPs, reducing stress and providing good Z-axis performance. Non-conductive films deliver toughness and high reliability for a wide die size range within leadframe or laminate packages.
Fast flow, void-free advanced underfills ensure thorough encapsulation of high-density interconnects on the most challenging architectures, including advanced Si node flip chips.
Electrically conductive and non-conductive lid attach adhesives address the increasing demands of SoC packaging, helping to protect devices against stress and warpage.
Microcontroller units (MCUs) manage everything from powertrains to entertainment systems and advanced driving features. Modern vehicles contain numerous MCUs, which are becoming increasingly complex as they integrate multi-core designs, large I/O packages, and high-reliability flip-chip packaging architectures. Device and interconnect protection, thermal management, and warpage control are critical for reliable performance.
High thermal die attach pastes deliver efficient heat removal at the die interface, providing excellent CTE stress control and maximizing performance, reliability, and system lifetime.
Pressure-less sintering formulations with thermal conductivity as high as 200 W/m-K enable integration of next-gen SiC and GaN WBG semiconductors using standard die attach processing.
Silver- and Copper-based pressure-assisted sintering materials are optimized to ensure thorough sintering at lower pressure and temperature than other commercialized formulas. High thermal conductivity (>200W/m-K) and very low porosity improve reliability for die attach, AMB, and large-area sintering applications.
Many power semiconductor package designs are migrating from silicon to higher-efficiency wide-bandgap (WBG) substrates - silicon carbide (SiC) and gallium nitride (GaN) – to enable high-frequency, high-power discretes and power modules. Due to their high power density, WBG semiconductors require sintering or other high thermal conductivity die attach materials to manage heat and meet demanding automotive standards.
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