Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically conductive adhesives


General purpose, electrically conductive adhesive for high-speed dispensing 

This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.  

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 230°F (110°C) – supporting fast handling.  


Die Attach

Cure type:

Heat Cure

Extractable ionic content, Chloride (CI-):

19.0 ppm

Extractable ionic content, Potassium (K+):

4.0 ppm

Extractable ionic content, Sodium (Na+):

29.0 ppm

Hot die shear strength:

0.96 kg-f

RT die shear strength, 2 x 2 mm Si die on Pd:

1.9 kg-f

Tensile modulus, @ 250.0 °C:

450.0 N/mm² (65000.0 psi)

Thixotropic index:


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