Electrically conductive adhesives
General purpose electrically conductive adhesive for high-speed dispensing
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
-
Snap curable for quick handling
-
Low stress bonding
-
1-part: no mixing required
-
Suitable for variety of package sizes
Applications:
Die attach
Cure type:
Heat cure
Extractable ionic content, Chloride (CI-):
19.0 ppm
Extractable ionic content, Potassium (K+):
4.0 ppm
Extractable ionic content, Sodium (Na+):
29.0 ppm
Hot die shear strength:
0.96 kg-f
RT die shear strength, 2 x 2 mm Si die on Pd:
1.9 kg-f
Tensile modulus, @ 250.0 °C:
450.0 N/mm² (65000.0 psi)
Thixotropic index:
4.6