Part no. (SKU/IDH):
1201456
IDH Name:
LOCTITE® ABLESTIK 2035SC
Electrically non-conductive adhesives
Electrically non-conductive, die-attach adhesive for minimizing stress
This 1-part, electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
Part no. (SKU/IDH):
1201456
IDH Name:
LOCTITE® ABLESTIK 2035SC
Packaging type Please make your selection Any kind of pack., excl. bulk
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Question & answer
LOCTITE® ABLESTIK 2035SC is a 1-part, non-conductive adhesive formulated for use in high throughput die attach applications. It is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Electrically non-conductive
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1-part: no mixing required
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Fast cure
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Low cure temperature
- Product category:
- Die attach adhesives
Technologies:
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Electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 54.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 128.0 ppm/°C
- Cure schedule, Recommended, @ 110.0 °C:
- 90.0 s
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 29.0 ppm
- Extractable ionic content, Potassium (K+):
- 19.0 ppm
- Extractable ionic content, Sodium (Na+):
- 89.0 ppm
- Glass transition temperature (Tg):
- 120.0 °C
- Hot die shear strength:
- 7.0 kg-f
- Key characteristics:
- Conductivity: electrically non-conductive
- RT die shear strength:
- 25.0 kg-f
- Tensile modulus, DMTA, @ 25.0 °C:
- 68.0 N/mm² (10000.0 psi)
- Thermal conductivity:
- 0.35 W/mK
- Thixotropic index:
- 4.2
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 11000.0 mPa·s (cP)
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Large volume or special order?
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