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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Electrically non-conductive adhesives


Electrically non-conductive, die attach adhesive designed to minimize stress

This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).

Product category:

Die attach adhesives



Die attach

Coefficient of thermal expansion (CTE):

54.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

128.0 ppm/°C

Cure schedule, Recommended, @ 110.0 °C:

90.0 sec.

Cure type:

Heat cure

Extractable ionic content, Chloride (CI-):

29.0 ppm

Extractable ionic content, Potassium (K+):

19.0 ppm

Extractable ionic content, Sodium (Na+):

89.0 ppm

Glass transition temperature (Tg):

120.0 °C

Hot die shear strength:

7.0 kg-f

Key characteristics:

Conductivity: electrically non-conductive

RT die shear strength:

25.0 kg-f

Tensile modulus, DMTA, @ 25.0 °C:

68.0 N/mm² (10000.0 psi)

Thermal conductivity:

0.35 W/mK

Thixotropic index:


Viscosity, Brookfield CP51, @ 25.0 °C:

11000.0 mPa·s (cP)

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