Part no. (SKU/IDH):
1201456
IDH Name:
LOCTITE® ABLESTIK 2035SC
Electrically non-conductive adhesives
Electrically non-conductive, die-attach adhesive for minimizing stress
This 1-part, electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
Part no. (SKU/IDH):
1201456
IDH Name:
LOCTITE® ABLESTIK 2035SC
Packaging type Please make your selection Any kind of pack., excl. bulk
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 2035SC is a 1-part, non-conductive adhesive formulated for use in high throughput die attach applications. It is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
-
Electrically non-conductive
-
1-part: no mixing required
-
Fast cure
-
Low cure temperature
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 54.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 128.0 ppm/°C
- Cure schedule, Recommended, @ 110.0 °C:
- 90.0 sec.
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 29.0 ppm
- Extractable ionic content, Potassium (K+):
- 19.0 ppm
- Extractable ionic content, Sodium (Na+):
- 89.0 ppm
- Glass transition temperature (Tg):
- 120.0 °C
- Hot die shear strength:
- 7.0 kg-f
- Key characteristics:
- Conductivity: electrically non-conductive
- RT die shear strength:
- 25.0 kg-f
- Tensile modulus, DMTA, @ 25.0 °C:
- 68.0 N/mm² (10000.0 psi)
- Thermal conductivity:
- 0.35 W/mK
- Thixotropic index:
- 4.2
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 11000.0 mPa·s (cP)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.