Electrically conductive adhesives
Electrically conductive adhesive for SMD interconnections
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK CE 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. LOCTITE® ABLESTIK CE 3920 is formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure.
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Pb-free
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Offers a long work life
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No post-cure required
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Thermosetting
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Low viscosity and low CTE
- Product category:
- Electrically conductive adhesives
Technologies:
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Thermosets, electronics assembly materials
- Cure schedule, @ 150.0 °C:
- 5.0 min.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Storage temperature:
- -40.0 °C
- Thixotropic index:
- 5.7
- Viscosity, cone & plate, Angle 3°, Speed 5 rpm:
- 26100.0 mPa·s (cP)
- Volume resistivity, @ 25.0 °C:
- 0.0003 Ohm cm
