Die attach adhesives
Conductive die-attach adhesive for high-reliability package applications
This highly filled conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK CDF 200 is a silver, highly filled, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong adhesion to various wafer metallizations and lead frame finishes and is typically used for QFN, SOIC and SO package applications. It works on various die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm and is ideal when tight control of resin bleed-out is required. LOCTITE ABLESTIK ABP 8303A is based on hybrid chemistry, cures when exposed to heat and provides a consistent bond line thickness.
-
Good for thin wafer handling applications
-
Film thickness: 15µm and 30µm
-
Offers high MSL reliability
-
No resin bleed-out
-
Low in-package thermal and electrical resistance
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Adhesive film thickness:
- 15.0 µm
- Dicing tape diameter:
- 8.0
- Hot die shear strength:
- 5.2 kg-f
- Tensile modulus, @ 25.0 °C:
- 5400.0 N/mm² (783200.0 psi)
- Wafer diameter:
- 8.0
