LOCTITE^® ABLESTIK CDF 200 is a silver, highly filled, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong adhesion to various wafer metallizations and lead frame finishes and is typically used for QFN, SOIC and SO package applications. It works on various die sizes ranging from 0.2 mm x 0.2 mm (0.008" x 0.008") to 5 mm x 5 mm (0.2" x 0.2") and is ideal when tight control of resin bleed-out is required. It is based on hybrid chemistry, cures when exposed to heat and provides a consistent bondline thickness.