Die attach adhesives
Snap curable, electrically conductive die-attach adhesive
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability packaging applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 8301 is a silver, electrically conductive die-attach adhesive for high-reliability packaging applications, suitable for a wide range of substrates (PPF, bare copper and silver) and package sizes. It’s formulated with an epoxy hybrid resin, cures snappy when exposed to heat and demonstrates low stress and improved hot/wet die shear strength.
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Snap curable
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Low stress
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High reliability
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Suitable for a wide range of package sizes
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Improved JEDEC performance
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 5.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Hot die shear strength:
- 15.0 kg-f
- Number of components:
- 1 part
- Physical form:
- Paste
- RT die shear strength:
- 2.0 kg-f
- Recommended for use with:
- LeadFrame: gold,LeadFrame: silver
- Tensile modulus, @ 250.0 °C:
- 60.0 N/mm² (8700.0 psi)
