Die attach adhesives
Low-temperature cure sintering die-attach adhesive for semiconductor packaging
This 1-part, low-temperature curing, dispensable die-attach adhesive is designed for high thermal and electrical lead frame packaging.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK ABP 8068TI is a silver-filled, pressure-less sintering die-attach adhesive for semiconductor packages that require high thermal and electrical conductivity. It’s particularly used for QFN, LGA and HBLED packaging in automotive and industrial applications and shows excellent sintering properties when used on Ag, Au and PPF lead frames. It has been shown to provide better thermal performance than solder paste. It’s formulated with an epoxy-assisted sintering technology, cures when exposed to heat and produces a void-free bondline.
-
Offers low stress
-
High reliability
-
Void-free bondline
-
Good toughness
-
Excellent workability and sintering properties
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
-
Acrylates, anaerobic cure
