Automotive semiconductor innovation is at an inflection point. Recently, Henkel surveyed automotive semiconductor engineers to uncover insights and priorities.
81.3% of respondents rank advanced materials essential to meeting stringent automotive standards, including thermal cycling, vibration, and moisture resistance.
Achieve improved reliability, precision assembly, and high compute density, alongside sustainable practices and partnerships.
Sensors and control units need reliability, precision, performance, and longevity (for ADAS and autonomous vehicles).
As controller architectures shift from distributed to centralized configurations, assembly mandates materials that reduce thermal, mechanical, and physical stress.
SiC and GaN semiconductors need thermal management, reliability, and electromagnetic compatibility for dense designs.
Semiconductor manufacturers are fortifying supply chain resiliency by focusing on upstream capabilities to mitigate supply chain bottlenecks and strategic vulnerabilities.
Semiconductor manufacturers are managing ESG regulatory compliance and high-energy manufacturing processes in three primary ways.
Innovative semiconductor engineers and new materials and designs are enabling the next era of mobility. Semiconductor packaging solutions must expand beyond today’s limits of reliability, precision, and safety while mitigating supply chain risks and progressing environmental initiatives via partnerships and collaborations.
Read the full research report and survey demographics
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