Die attach adhesives
B-stageable die-attach adhesive for laminate-based packages
This B-stageable adhesive is ideal for chip-scale packages and stencil printing, especially on laminate-based packages where tolerance and bleed must be minimized.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 6202C-X is a yellow, b-stageable die-attach adhesive perfect for laminate-based packages where tolerance and bleed must be minimized. It has a long work life, low moisture uptake, low flow (<150µm), low warpage and low modulus, making it ideal for large die sizes. LOCTITE ABLESTIK 6202C-X is designed with a proprietary hybrid chemistry technology and cures when exposed to heat.
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Designed for stencil printing
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Low modulus
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Offers a long work life
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Low flow and low moisture uptake
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Low warpage
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
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Thermal management, standard viscosity liquids
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 70.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 232.0 ppm/°C
- Cure type:
- Heat cure
- Density, Maximum Final:
- 1.1 g/cm³
- Extractable ionic content, Chloride (CI-):
- 25.0 ppm
- Extractable ionic content, Potassium (K+):
- 10.0 ppm
- Extractable ionic content, Sodium (Na+):
- 25.0 ppm
- Glass transition temperature (Tg):
- 40.0 °C
- Hot die shear strength:
- 1.0 kg-f
- RT die shear strength:
- 10.0 kg-f
- Tensile modulus, DMTA, @ 250.0 °C:
- 6.0 N/mm² (812.0 psi)
- Thixotropic index:
- 2.5
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 30000.0 mPa·s (cP)
